Metal-containing particle, connection material, connection structure, method for manufacturing connection structure, conduction inspection member, and conduction inspection device
US-2020269315-A1 · Aug 27, 2020 · US
US11810706B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11810706-B2 |
| Application number | US-202016830170-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 25, 2020 |
| Priority date | Mar 27, 2019 |
| Publication date | Nov 7, 2023 |
| Grant date | Nov 7, 2023 |
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An inductor component includes a base, an inductor device disposed in the base, and an external terminal serving as a line that is disposed on the base and that is electrically coupled to the inductor device. The external terminal includes a first metal film that is in contact with the base and that is electrically conductive, a second metal film disposed on a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching, and a catalytic layer disposed between the first metal film and the second metal film. The first metal film includes a pore portion adjacent to the catalytic layer.
Opening claim text (preview).
What is claimed is: 1. A multilayer metal film disposed on a base having insulating properties, comprising: a first metal film in contact with the base, the first metal film being electrically conductive; a second metal film covering the first metal film from a side of the first metal film opposite to the base, the second metal film having resistance to solder leaching; and a catalytic layer disposed between the first metal film and the second metal, the first metal film including a pore portion adjacent to the catalytic layer. 2. The multilayer metal film according to claim 1 , wherein the pore portion of the first metal film is hollow. 3. The multilayer metal film according to claim 1 , wherein the pore portion of the first metal film is present in a range extending from a first main surface of the first metal film adjacent to the catalytic layer to a position about ¼ or less of a film thickness of the first metal film away from the first main surface. 4. The multilayer metal film according to claim 1 , wherein the pore portion of the first metal film has a size of about 0.5 μm or less. 5. The multilayer metal film according to claim 1 , wherein the first metal film and the second metal film are electrically coupled to each other. 6. The multilayer metal film according to claim 1 , wherein the first metal film has lower hardness than the second metal film. 7. The multilayer metal film according to claim 1 , wherein the base includes a magnetic resin layer containing a resin and a magnetic metal powder contained in the resin, and the first metal film is in contact with the magnetic resin layer. 8. The multilayer metal film according to claim 1 , further comprising: a third metal film on the second metal film, the third metal film having wettability. 9. The multilayer metal film according to claim 1 , wherein the first metal film contains Cu. 10. The multilayer metal film according to claim 1 , wherein the second metal film contains Ni. 11. The multilayer metal film according to claim 1 , wherein the catalytic layer contains Pd. 12. An inductor component, comprising: the base; the multilayer metal film according to claim 1 ; and an inductor device disposed in the base, the multilayer metal film serving as an external terminal exposed at the base, the external terminal being electrically coupled to the inductor device. 13. The multilayer metal film according to claim 2 , wherein the pore portion of the first metal film is present in a range extending from a first main surface of the first metal film adjacent to the catalytic layer to a position about ¼ or less of a film thickness of the first metal film away from the first main surface. 14. The multilayer metal film according to claim 2 , wherein the pore portion of the first metal film has a size of about 0.5 μm or less. 15. The multilayer metal film according to claim 2 , wherein the first metal film and the second metal film are electrically coupled to each other. 16. The multilayer metal film according to claim 2 , wherein the first metal film has lower hardness than the second metal film. 17. The multilayer metal film according to claim 2 , wherein the base includes a magnetic resin layer containing a resin and a magnetic metal powder contained in the resin, and the first metal film is in contact with the magnetic resin layer. 18. The multilayer metal film according to claim 2 , further comprising: a third metal film on the second metal film, the third metal film having wettability. 19. The multilayer metal film according to claim 2 , wherein the first metal film contains Cu. 20. The multilayer metal film according to claim 1 , wherein the catalytic layer includes a plurality of protrusions.
Mounting, supporting or suspending transformers, reactors or choke coils {not being of the signal type} · CPC title
made from particles (H01F27/26 takes precedence) · CPC title
Terminals; Tapping arrangements {for signal inductances} · CPC title
with stacked layers · CPC title
Printed inductances (printed coils for dynamo-electric machines H02K3/26; printed circuits H05K) · CPC title
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