Magnetic wiring circuit board and producing method thereof
US-11508507-B2 · Nov 22, 2022 · US
Electronic component and production method thereof
US11721469B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11721469-B2 |
| Application number | US-202016995176-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 17, 2020 |
| Priority date | Sep 3, 2019 |
| Publication date | Aug 8, 2023 |
| Grant date | Aug 8, 2023 |
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- Title
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- Abstract
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- Assignees and inventors
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- First independent claim
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Abstract
Official abstract text for this publication.
An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Ni and is in contact with the resin and the magnetic metal powder.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic component, comprising: a composite body composed of a composite material of a resin and a magnetic metal powder; and a metal film disposed on an outer surface of the composite body, the magnetic metal powder containing Fe, the metal film mainly containing Ni, and further containing at least one of P or Fe, and being in contact with the resin and the magnetic metal powder. 2. The electronic component according to claim 1 , wherein the metal film is amorphous. 3. The electronic component according to claim 2 , wherein the metal film further contains Fe. 4. The electronic component according to claim 2 , wherein the metal film further contains P. 5. The electronic component according to claim 4 , wherein the metal film further contains Fe. 6. The electronic component according to claim 4 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 7. The electronic component according to claim 4 , wherein the metal film has a P content of from about 1% by weight to about 13% by weight. 8. The electronic component according to claim 7 , wherein the metal film further contains Fe. 9. The electronic component according to claim 7 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 10. The electronic component according to claim 2 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 11. The electronic component according to claim 1 , wherein the metal film further contains P. 12. The electronic component according to claim 11 , wherein the metal film further contains Fe. 13. The electronic component according to claim 11 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 14. The electronic component according to claim 11 , wherein the metal film has a P content of from about 1% by weight to about 13% by weight. 15. The electronic component according to claim 14 , wherein the metal film further contains Fe. 16. The electronic component according to claim 14 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 17. The electronic component according to claim 1 , wherein the metal film further contains Fe. 18. The electronic component according to claim 17 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 19. The electronic component according to claim 1 , further comprising: an inductor line disposed in the composite body and extending parallel to the outer surface; a substantially columnar line extending from the inductor line in a direction perpendicular to the outer surface, penetrating through the composite body, and being exposed at the outer surface; and a solderable layer covering the metal film, wherein the metal film is in contact with the substantially columnar line, and the metal film and the solderable layer are included in an external terminal. 20. A method for producing the electronic component according to claim 1 , the method comprising: forming the metal film on an outer surface of the composite body by electroless plating treatment; and depositing the metal film on the magnetic metal powder by autocatalytic reduction plating treatment so that the metal film is in contact with the resin.
Assignees
Inventors
Classifications
- H01F17/04Primary
with magnetic core · CPC title
in the form of particles, e.g. powder (H01F1/047 takes precedence {; record carriers G11B5/70605}) · CPC title
metals or alloys · CPC title
by macromolecular organic substances · CPC title
made from particles (H01F27/26 takes precedence) · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11721469B2 cover?
- An electronic component includes a composite body composed of a composite material of a resin and a magnetic metal powder and a metal film disposed on an outer surface of the composite body. The magnetic metal powder contains Fe. The metal film mainly contains Ni and is in contact with the resin and the magnetic metal powder.
- Who is the assignee on this patent?
- Murata Manufacturing Co
- What technology area does this patent fall under?
- Primary CPC classification H01F17/04. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Aug 08 2023 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).