Fan out package with integrated peripheral devices and methods
US-2025309017-A1 · Oct 2, 2025 · US
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Ort Thomas patents
Ort Thomas is listed as an inventor on 26 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ort Thomas |
| Total patents | 26 |
| First publication | Jul 4, 2019 |
| Latest publication | Oct 2, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Fan out package with integrated peripheral devices and methods
US-12362251-B2 · Jul 15, 2025 · US
Package formation methods including coupling a molded routing layer to an integrated routing layer
US-2024355697-A1 · Oct 24, 2024 · US
Package formation methods including coupling a molded routing layer to an integrated routing layer
US-12057364-B2 · Aug 6, 2024 · US
Fan out package with integrated peripheral devices and methods
US-2024194552-A1 · Jun 13, 2024 · US
Fan out package with integrated peripheral devices and methods
US-11955395-B2 · Apr 9, 2024 · US
Semiconductor packages, and methods for forming semiconductor packages
US-11764187-B2 · Sep 19, 2023 · US
Fan out package and methods
US-2023090265-A1 · Mar 23, 2023 · US
Fan out package and methods
US-11508637-B2 · Nov 22, 2022 · US
Fan out package with integrated peripheral devices and methods
US-2022336306-A1 · Oct 20, 2022 · US
Recent patents
Latest publications not already listed above.
Fan out package with integrated peripheral devices and methods
US-11404339-B2 · Aug 2, 2022 · US
Face-up fan-out electronic package with passive components using a support
US-2022051990-A1 · Feb 17, 2022 · US
Face-up fan-out electronic package with passive components using a support
US-11211337-B2 · Dec 28, 2021 · US
Component magnetic shielding for microelectronic devices
US-10867934-B2 · Dec 15, 2020 · US
Fan out package with integrated peripheral devices and methods
US-2020303274-A1 · Sep 24, 2020 · US
Fan out package and methods
US-2020251396-A1 · Aug 6, 2020 · US
Molded substrate package in fan-out wafer level package
US-10720393-B2 · Jul 21, 2020 · US
Semiconductor Packages, and Methods for Forming Semiconductor Packages
US-2020227388-A1 · Jul 16, 2020 · US
Fan out package with integrated peripheral devices and methods
US-10699980-B2 · Jun 30, 2020 · US
Package including an integrated routing layer and a molded routing layer
US-10665522-B2 · May 26, 2020 · US
Face-up fan-out electronic package with passive components using a support
US-10546817-B2 · Jan 28, 2020 · US
Molded substrate package in fan-out wafer level package
US-2019393154-A1 · Dec 26, 2019 · US
Component magnetic shielding for microelectronic devices
US-2019304922-A1 · Oct 3, 2019 · US
Molded substrate package in fan-out wafer level package
US-10403580-B2 · Sep 3, 2019 · US
Face-up fan-out electronic package with passive components using a support
US-2019206799-A1 · Jul 4, 2019 · US
Molded substrate package in fan-out wafer level package
US-2019206800-A1 · Jul 4, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Ip Corp | 14 |
| Intel Corp | 13 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/019 | 24 |
| H10W70/614 | 24 |
| H10W74/142 | 22 |
| H10W70/09 | 22 |
| H10W90/701 | 22 |