Face-up fan-out electronic package with passive components using a support

Patent metadata

Field	Value
Publication number	US-11211337-B2
Application number	US-201916703315-A
Country	US
Kind code	B2
Filing date	Dec 4, 2019
Priority date	Dec 28, 2017
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A face-up fan-out electronic package including at least one passive component located on a support. The electronic package can include a die. The die can include a plurality of conductive pillars having a proximal end communicatively coupled to the first side of the die and a distal end opposite the proximal end. A mold can at least partially surround the die. The mold can include a first surface that is coplanar with the distal end of the conductive pillars and a second surface opposing the first surface. In an example, the passive component can include a body and a lead. The passive component can be located within the mold. The lead can be coplanar with the first surface, and the body can be located at a distance from the second surface. The support can be located between the body and the second surface.

First claim

What is claimed is:

1. A device comprising:
a die having a first side and a second side;
a conductive pillar including a first end communicatively coupled to the first side of the die and a second end opposite the first end;
a mold at least partially surrounding the die, the mold including a first surface that is coplanar with the second end of the conductive pillar and a second surface opposing the first surface and coplanar with the second side of the die;
a passive component including a body and a lead within the mold, the lead and the body coplanar with the first surface; and
a support located between the passive component and the second surface.

2. The electronic package of claim 1 , further comprising a routing layer electrically coupled to the second end of the conductive pillar.

3. The electronic package of claim 1 , wherein the passive component is a first passive component, and the device further comprises a second passive component, the first passive component is located on the support, wherein the support is a first support, and the second passive component located on a second support, the first support including a different height than the second support.

4. The electronic package of claim 1 , further comprising an adhesive coupled between the passive component and the support.

5. The electronic package of claim 1 , further comprising a support frame, the support frame located along the second surface of the mold and coupled to the support, wherein the support frame holds the support or a plurality of supports in fixed relation with respect to the support frame.

6. The electronic package of claim 5 , wherein the support frame is electrically coupled to the die and configured as a ground plane.

7. The electronic package of claim 5 , wherein the support frame is thermally coupled to the second die side and configured as a heat sink.

8. The electronic package of claim 5 , wherein the support frame includes a die holder, the die holder configured to anchor the die with respect to the support.

9. The electronic package of claim 5 , wherein the support frame is exposed through the second surface of the mold.

10. The electronic package of claim 1 , further comprising a via located between the lead and the second surface, the via including a first end and a second end, wherein the first end is coplanar with the first surface.

11. The electronic package of claim 1 , the second side of the die is exposed through the second surface of the mold.

12. The electronic package of claim 1 , wherein the support includes a first end and a second end, wherein the second end is exposed through the second surface of the mold.

13. A device comprising:
a die having a first side and a second side;
a plurality of conductive pillars, each of the conductive pillars including a first end communicatively coupled to the first side of the die and a second end opposite the first end;
a mold at least partially surrounding the die, the mold including a first surface that is coplanar with the second end of the conductive pillars and a second surface opposing the first surface and coplanar with the second side of the die;
a passive component including a body and a lead within the mold, the lead coplanar with the first surface; and
a support located between the passive component and the second surface.

14. The electronic package of claim 13 , further comprising a routing layer electrically coupled to the second end of the conductive pillars.

15. The electronic package of claim 13 , wherein the passive component is a first passive component, and the device further comprises a second passive component, the first passive component is located on the support, wherein the support is a first support, and the second passive component located on a second support, the first support including a different height than the second support.

16. The electronic package of claim 13 , further comprising an adhesive coupled between the passive component and the support.

17. The electronic package of claim 13 , further comprising a support frame, the support frame located along the second surface of the mold and coupled to the support, wherein the support frame holds the support or a plurality of supports in fixed relation with respect to the support frame.

18. The electronic package of claim 17 , wherein the support frame is electrically coupled to the die and configured as a ground plane.

19. The electronic package of claim 17 , wherein the support frame is thermally coupled to the second die side and configured as a heat sink.

20. The electronic package of claim 17 , wherein the support frame includes a die holder, the die holder configured to anchor the die with respect to the support.

Assignees

• Intel Corp

Inventors

• Keser Lizabeth
• Ort Thomas
• Wagner Thomas
• Waidhas Bernd

Classifications

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title