Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-10508349-B2 · Dec 17, 2019 · US
This page is not indexed by search engines while we improve data quality.
Niazimbetova Zuhra patents
Niazimbetova Zuhra is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Niazimbetova Zuhra |
| Total patents | 16 |
| First publication | Sep 1, 2016 |
| Latest publication | Dec 17, 2019 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of filling through-holes to reduce voids and other defects
US-10508357-B2 · Dec 17, 2019 · US
Polymers containing benzimidazole moieties as levelers
US-10201097-B2 · Feb 5, 2019 · US
Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
US-10190228-B2 · Jan 29, 2019 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US-10100421-B2 · Oct 16, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
US-10104782-B2 · Oct 16, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-10006136-B2 · Jun 26, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US-9932684-B2 · Apr 3, 2018 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides
US-2017370014-A1 · Dec 28, 2017 · US
Copper electroplating baths and electroplating methods capable of electroplating megasized photoresist defined features
US-2017283970-A1 · Oct 5, 2017 · US
Recent patents
Latest publications not already listed above.
Method of filling through-holes to reduce voids and other defects
US-2017233886-A1 · Aug 17, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
US-2017037526-A1 · Feb 9, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole compounds, bisepoxides and halobenzyl compounds
US-2017037528-A1 · Feb 9, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyridyl alkylamines and bisepoxides
US-2017042037-A1 · Feb 9, 2017 · US
Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of alpha amino acids and bisepoxides
US-2017037527-A1 · Feb 9, 2017 · US
Polymers containing benzimidazole moieties as levelers
US-2016255729-A1 · Sep 1, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Rohm & Haas Elect Mat | 16 |
| Dow Global Technologies Llc | 10 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D7/123 | 16 |
| C25D3/38 | 16 |
| C25D7/00 | 16 |
| C25D5/022 | 12 |
| G03F7/0002 | 10 |