Semiconductor manufacturing apparatus and method for manufacturing semiconductor device
US-2026024727-A1 · Jan 22, 2026 · US
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Nakajima Shigeru patents
Nakajima Shigeru is listed as an inventor on 52 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nakajima Shigeru |
| Total patents | 52 |
| First publication | Jul 30, 2015 |
| Latest publication | Jan 22, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Film deposition apparatus for fine pattern forming
US-2025226177-A1 · Jul 10, 2025 · US
Film deposition apparatus for fine pattern forming
US-12288671-B2 · Apr 29, 2025 · US
Method and apparatus for embedding tungsten into recess formed on substrate
US-2024295020-A1 · Sep 5, 2024 · US
Measurement method and measurement device
US-2024280628-A1 · Aug 22, 2024 · US
Friction material
US-2024209910-A1 · Jun 27, 2024 · US
Film deposition apparatus for fine pattern forming
US-2024096595-A1 · Mar 21, 2024 · US
Decorative sheet, embossing method and embossing die
US-11884048-B2 · Jan 30, 2024 · US
Film deposition apparatus for fine pattern forming
US-11881379-B2 · Jan 23, 2024 · US
Decorative sheet, embossing method and embossing die
US-11529759-B2 · Dec 20, 2022 · US
Recent patents
Latest publications not already listed above.
Metal contamination prevention method and apparatus, and substrate processing method using the same and apparatus therefor
US-11486043-B2 · Nov 1, 2022 · US
Film deposition apparatus for fine pattern forming
US-2022328301-A1 · Oct 13, 2022 · US
Embossing die, embossing apparatus and embossing method
US-11458670-B2 · Oct 4, 2022 · US
Film deposition apparatus for fine pattern forming
US-11404272-B2 · Aug 2, 2022 · US
Film deposition apparatus for fine pattern forming
US-11404271-B2 · Aug 2, 2022 · US
Semiconductor device which detects occurrence of an abnormality during operation based on a comparison of an input specifying a PWM signal and an estimated input obtained from an inverse operation
US-11327829-B2 · May 10, 2022 · US
Decorative sheet
US-11254246-B2 · Feb 22, 2022 · US
Film forming apparatus and film forming method
US-11047044-B2 · Jun 29, 2021 · US
Film forming method, film forming system, and film forming apparatus
US-2021115560-A1 · Apr 22, 2021 · US
Decorative Sheet, Embossing Method And Embossing Die
US-2021001592-A1 · Jan 7, 2021 · US
Decorative Sheet, Embossing Method And Embossing Die
US-2020406529-A1 · Dec 31, 2020 · US
Mask pattern forming method, fine pattern forming method, and film deposition apparatus
US-10879066-B2 · Dec 29, 2020 · US
Embossing Apparatus
US-2020316846-A1 · Oct 8, 2020 · US
Semiconductor device
US-2020285536-A1 · Sep 10, 2020 · US
Embossing Die, Embossing Apparatus And Embossing Method
US-2020282631-A1 · Sep 10, 2020 · US
Decorative Sheet
US-2020282884-A1 · Sep 10, 2020 · US
Bolt fastening method for lower link
US-10690048-B2 · Jun 23, 2020 · US
Motor control device
US-10630221-B2 · Apr 21, 2020 · US
Metal Contamination Prevention Method and Apparatus, and Substrate Processing Method Using the Same and Apparatus Therefor
US-2020040463-A1 · Feb 6, 2020 · US
Mask pattern forming method, fine pattern forming method, and film deposition apparatus
US-2019115204-A1 · Apr 18, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Tokyo Electron Ltd | 33 |
| Seiren Co Ltd | 9 |
| Toshiba Kk | 5 |
| Nissan Motor | 4 |
| Toshiba Electronic Devices & Storage Corp | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/6339 | 22 |
| H01L21/0228 | 19 |
| C23C16/402 | 17 |
| C23C16/403 | 17 |
| H10P14/69215 | 17 |