Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
US-11307497-B2 · Apr 19, 2022 · US
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Nagai Hiroko patents
Nagai Hiroko is listed as an inventor on 14 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Nagai Hiroko |
| Total patents | 14 |
| First publication | Oct 4, 2018 |
| Latest publication | Apr 19, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Composition for forming organic film
US-11042090-B2 · Jun 22, 2021 · US
Compound and composition for forming organic film
US-11022882-B2 · Jun 1, 2021 · US
Compound, method for manufacturing the compound, and composition for forming organic film
US-10604618-B2 · Mar 31, 2020 · US
Compound, method for manufacturing the compound, and composition for forming organic film
US-2019390000-A1 · Dec 26, 2019 · US
Compound and composition for forming organic film
US-2019391493-A1 · Dec 26, 2019 · US
Resist multilayer film-attached substrate and patterning process
US-10514605-B2 · Dec 24, 2019 · US
Compound, composition for forming organic film, substrate for manufacturing semiconductor apparatus, method for forming organic film, and patterning process
US-2019300498-A1 · Oct 3, 2019 · US
Resist underlayer film composition, patterning process, and method for forming resist underlayer film
US-10416563-B2 · Sep 17, 2019 · US
Resist underlayer film composition, patterning process, and method for forming resist underlayer film
US-10241412-B2 · Mar 26, 2019 · US
Recent patents
Latest publications not already listed above.
Resist multilayer film-attached substrate and patterning process
US-2019041753-A1 · Feb 7, 2019 · US
Composition for forming organic film
US-2019041752-A1 · Feb 7, 2019 · US
Resist underlayer film composition, patterning process, and method for forming resist underlayer film
US-2018284615-A1 · Oct 4, 2018 · US
Resist underlayer film composition, patterning process, and method for forming resist underlayer film
US-2018284614-A1 · Oct 4, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Shinetsu Chemical Co | 14 |
| IBM | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/094 | 14 |
| G03F7/11 | 14 |
| H10P50/287 | 12 |
| H10P50/73 | 10 |
| C07C2603/18 | 10 |