Molybdenum deposition
US-2025323046-A1 · Oct 16, 2025 · US
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Na Jeong-Seok patents
Na Jeong-Seok is listed as an inventor on 23 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Na Jeong-Seok |
| Total patents | 23 |
| First publication | Feb 9, 2016 |
| Latest publication | Oct 16, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Molybdenum integration and void-free fill
US-2025259894-A1 · Aug 14, 2025 · US
Molybdenum deposition
US-12334351-B2 · Jun 17, 2025 · US
Low resistance molybdenum deposition for logic source/drain contacts
US-2025183041-A1 · Jun 5, 2025 · US
Low resistivity contacts and interconnects
US-2025183097-A1 · Jun 5, 2025 · US
Molybdenum deposition in features
US-2024047269-A1 · Feb 8, 2024 · US
Low resistivity contacts and interconnects
US-2023326790-A1 · Oct 12, 2023 · US
Molybdenum deposition
US-2022328317-A1 · Oct 13, 2022 · US
Depositing ruthenium layers in interconnect metallization
US-10731250-B2 · Aug 4, 2020 · US
Manganese barrier and adhesion layers for cobalt
US-10438847-B2 · Oct 8, 2019 · US
Recent patents
Latest publications not already listed above.
Selective deposition of WCN barrier/adhesion layer for interconnect
US-10283404-B2 · May 7, 2019 · US
Methods and apparatus for forming smooth and conformal cobalt film by atomic layer deposition
US-10242879-B2 · Mar 26, 2019 · US
Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide
US-10229826-B2 · Mar 12, 2019 · US
Depositing ruthenium layers in interconnect metallization
US-2018347041-A1 · Dec 6, 2018 · US
Methods and apparatus for forming smooth and conformal cobalt film by atomic layer deposition
US-2018308701-A1 · Oct 25, 2018 · US
Selective deposition of wcn barrier/adhesion layer for interconnect
US-2018286746-A1 · Oct 4, 2018 · US
Systems and methods for forming low resistivity metal contacts and interconnects by reducing and removing metallic oxide
US-2018114694-A1 · Apr 26, 2018 · US
Manganese barrier and adhesion layers for cobalt
US-2017330797-A1 · Nov 16, 2017 · US
Method for void-free cobalt gap fill
US-9748137-B2 · Aug 29, 2017 · US
Method for void-free cobalt gap fill
US-9349637-B2 · May 24, 2016 · US
Method for void-free cobalt gap fill
US-2016056077-A1 · Feb 25, 2016 · US
Method for void-free cobalt gap fill
US-2016056074-A1 · Feb 25, 2016 · US
Systems and methods for remote plasma atomic layer deposition
US-9255326-B2 · Feb 9, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 22 |
| Novellus Systems Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/432 | 18 |
| H10P14/43 | 16 |
| C23C16/045 | 16 |
| H10W20/4403 | 15 |
| H10W20/057 | 14 |