Silicon carbide devices and methods for manufacturing the same
US-11282805-B2 · Mar 22, 2022 · US
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Menath Markus patents
Menath Markus is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Menath Markus |
| Total patents | 22 |
| First publication | Feb 10, 2015 |
| Latest publication | Mar 22, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamber
US-11077525-B2 · Aug 3, 2021 · US
Method for use in manufacturing a semiconductor device die
US-10510626-B2 · Dec 17, 2019 · US
Method of Processing a Silicon Carbide Containing Crystalline Substrate, Silicon Carbide Chip, and Processing Chamber
US-2019308274-A1 · Oct 10, 2019 · US
Silicon Carbide Devices and Methods for Manufacturing the Same
US-2019295981-A1 · Sep 26, 2019 · US
Method for producing a conductor line
US-10090192-B2 · Oct 2, 2018 · US
Chip package and a method of producing the same
US-9981843-B2 · May 29, 2018 · US
Transformer comprising a rounded coil
US-9780161-B2 · Oct 3, 2017 · US
Method for use in manufacturing a semiconductor device die
US-2017092552-A1 · Mar 30, 2017 · US
Method for processing a wafer and method for dicing a wafer
US-2017084468-A1 · Mar 23, 2017 · US
Recent patents
Latest publications not already listed above.
Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
US-9576875-B2 · Feb 21, 2017 · US
Method for processing a wafer and method for dicing a wafer
US-9553021-B2 · Jan 24, 2017 · US
Method for use in manufacturing a semiconductor device die
US-9553022-B1 · Jan 24, 2017 · US
Method for use in manufacturing a semiconductor device die
US-2017011963-A1 · Jan 12, 2017 · US
Chip Package and a Method of Producing the Same
US-2016311679-A1 · Oct 27, 2016 · US
Method for Producing a Conductor Line
US-2016064273-A1 · Mar 3, 2016 · US
Method for Forming a Vertical Electrical Conductive Connection
US-2015380306-A1 · Dec 31, 2015 · US
Coil and Method of Manufacturing a Coil
US-2015372073-A1 · Dec 24, 2015 · US
Method for producing a conductor line
US-9214424-B2 · Dec 15, 2015 · US
Method for fabricating a coil by way of a rounded trench
US-9183977-B2 · Nov 10, 2015 · US
Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
US-2015115417-A1 · Apr 30, 2015 · US
Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
US-8951915-B2 · Feb 10, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 19 |
| Menath Markus | 4 |
| Infineon Technologies Austria | 2 |
| Fischer Thomas | 1 |
| Wendt Hermann | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P54/00 | 11 |
| H10P72/74 | 7 |
| H01L21/78 | 7 |
| H10W20/435 | 6 |
| H10W20/082 | 6 |