Method for processing a wafer and method for dicing a wafer
US-9553021-B2 · Jan 24, 2017 · US
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Menath Markus patents
Menath Markus holds 4 patents in our database, with recent filings and technology areas summarized below.
| Metric | Value |
|---|---|
| Total patents | 4 |
| Recent patents | 0 |
| First publication | Feb 10, 2015 |
| Latest publication | Jan 24, 2017 |
Filing trend
Year-over-year patent counts for this assignee.
Recent patents
Latest publications where this party is an assignee.
Method for producing a conductor line
US-9214424-B2 · Dec 15, 2015 · US
Method for fabricating a coil by way of a rounded trench
US-9183977-B2 · Nov 10, 2015 · US
Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
US-8951915-B2 · Feb 10, 2015 · US
Notable patents
Representative or frequently cited publications from precomputed assignee stats.
Method for processing a wafer and method for dicing a wafer
US-9553021-B2 · Jan 24, 2017 · US
Method for producing a conductor line
US-9214424-B2 · Dec 15, 2015 · US
Method for fabricating a coil by way of a rounded trench
US-9183977-B2 · Nov 10, 2015 · US
Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
US-8951915-B2 · Feb 10, 2015 · US
Technology areas
Mapped technology topics for this assignee.
| Technology | Patents |
|---|---|
| Electricity | 4 |
| Cross-Sectional Technologies | 1 |