Silicon thermalizer for cryogenic microwave application using a coplanar wave guide structure
US-2024230202-A9 · Jul 11, 2024 · US
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Mcvicker Gerard patents
Mcvicker Gerard is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mcvicker Gerard |
| Total patents | 30 |
| First publication | Jan 1, 2015 |
| Latest publication | Jul 11, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Silicon thermalizer for cryogenic microwave application using a coplanar wave guide structure
US-2024133609-A1 · Apr 25, 2024 · US
Solder creep limiting rigid spacer for stacked die c4 packaging
US-2023058638-A1 · Feb 23, 2023 · US
Thermal conduction layer
US-2023058897-A1 · Feb 23, 2023 · US
Pressure controllable encapsulated liquid thermal interface
US-11545415-B2 · Jan 3, 2023 · US
Traffic event recording and recreation
US-11276256-B2 · Mar 15, 2022 · US
Personal food database
US-11074831-B2 · Jul 27, 2021 · US
Pressure controllable encapsulated liquid thermal interface
US-2021183742-A1 · Jun 17, 2021 · US
TIM strain mitigation in electronic modules
US-10796978-B2 · Oct 6, 2020 · US
Chip package for two-phase cooling and assembly process thereof
US-10607963-B2 · Mar 31, 2020 · US
Recent patents
Latest publications not already listed above.
Tim strain mitigation in electronic modules
US-2019206762-A1 · Jul 4, 2019 · US
TIM strain mitigation in electronic modules
US-10325829-B2 · Jun 18, 2019 · US
Chip package for two-phase cooling and assembly process thereof
US-2018076113-A1 · Mar 15, 2018 · US
Personal food database
US-2018061270-A1 · Mar 1, 2018 · US
Traffic event recording and recreation
US-2018061151-A1 · Mar 1, 2018 · US
Tim strain mitigation in electronic modules
US-2018047654-A1 · Feb 15, 2018 · US
TIM strain mitigation in electronic modules
US-9837332-B2 · Dec 5, 2017 · US
Detection of vehicle operation characteristics
US-9830823-B1 · Nov 28, 2017 · US
Axiocentric scrubbing land grid array contacts and methods for fabrication
US-9565759-B2 · Feb 7, 2017 · US
Tim strain mitigation in electronic modules
US-2016365297-A1 · Dec 15, 2016 · US
Tim strain mitigation in electronic modules
US-9437519-B2 · Sep 6, 2016 · US
Two mask process for electroplating metal employing a negative electrophoretic photoresist
US-9410261-B2 · Aug 9, 2016 · US
Two mask process for electroplating metal employing a negative electrophoretic photoresist
US-9340892-B2 · May 17, 2016 · US
Axiocentric scrubbing land grid array contacts and methods for fabrication
US-2015334830-A1 · Nov 19, 2015 · US
Tim strain mitigation in electronic modules
US-2015243570-A1 · Aug 27, 2015 · US
Axiocentric scrubbing land grid array contacts and methods for fabrication
US-9040841-B2 · May 26, 2015 · US
Metallurgical clamshell methods for micro land grid array fabrication
US-2015133001-A1 · May 14, 2015 · US
Two mask process for electroplating metal employing a negative electrophoretic photoresist
US-2015060266-A1 · Mar 5, 2015 · US
Metallurgical clamshell methods for micro land grid array fabrication
US-8959764-B2 · Feb 24, 2015 · US
Method and system for thermomechanically decoupling heatsink
US-2015000097-A1 · Jan 1, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 26 |
| Mcvicker Gerard | 3 |
| Globalfoundries Inc | 3 |
| Hougham Gareth | 2 |
| Gu Xiaoxiong | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/734 | 11 |
| H10W90/724 | 11 |
| H10W74/15 | 11 |
| H10W72/877 | 11 |
| H10W40/70 | 11 |