Semiconductor device and method for forming the same
US-2024395669-A1 · Nov 28, 2024 · US
TIM strain mitigation in electronic modules
US10325829B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10325829-B2 |
| Application number | US-201715791809-A |
| Country | US |
| Kind code | B2 |
| Filing date | Oct 24, 2017 |
| Priority date | Feb 25, 2014 |
| Publication date | Jun 18, 2019 |
| Grant date | Jun 18, 2019 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
First claim
Opening claim text (preview).
What is being claimed: 1. A device comprising: a die; a thermal interface material disposed on the die; a heat spreading lid disposed on the thermal interface material opposite the die, the lid comprising: a lid body; and a wing portion disposed at a corner of the lid body; wherein the wing portion flexibly moves independently from the lid body, and wherein the wing portion is connected to a wing pedestal, the wing pedestal being disposed between the lid body and die. 2. The device according to claim 1 , wherein a gap is formed between the wing portion and a portion of the lid body above the lid portion. 3. The device according to claim 1 , wherein the lid body comprises a lid insert and a lid frame in which the lid insert is disposed, and wherein the wing portion comprises an edge portion of the lid insert. 4. The device according to claim 1 , wherein the wing portion is serrated. 5. The device according to claim 1 , wherein the lid includes a plurality of ones of the wing portion, and further comprising a trench extending between two adjacent wing portions.
Assignees
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Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
on active surfaces of flip-chip devices, e.g. underfills · CPC title
Bump connectors and die-attach connectors · CPC title
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US10325829B2 cover?
- A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10W40/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jun 18 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).