Limiting electronic package warpage
US-10056268-B2 · Aug 21, 2018 · US
TIM strain mitigation in electronic modules
US10796978B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10796978-B2 |
| Application number | US-201916285378-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 26, 2019 |
| Priority date | Feb 25, 2014 |
| Publication date | Oct 6, 2020 |
| Grant date | Oct 6, 2020 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
First claim
Opening claim text (preview).
What is being claimed: 1. A heat spreading lid, comprising: a lid body including: a bottom surface; a recess formed into the bottom surface; and a wing portion formed into the recess with a gap between a top surface of the wing portion and a surface of the lid body at a top of the recess, wherein the wing portion flexibly moves independently from the lid body, wherein a portion of the lid is arranged above the wing portion, on a side of the wing portion, and wherein a bottom surface of the wing portion installed in the recess is coplanar with the bottom surface of the lid body. 2. The heat spreading lid of claim 1 , wherein the wing portion and the lid body are integrally formed. 3. A device comprising: a die; a thermal interface material disposed on the die; and a heat spreading lid disposed on the thermal interface material opposite the die, the lid comprising: a lid body including; a bottom surface; a recess formed into the bottom surface; and a wing portion formed into the recess with a gap between a top surface of the wing portion and a surface of the lid body at a top of the recess, wherein the wing portion flexibly moves independently from the lid body, wherein a portion of the lid is arranged above the wing portion, on a side of the wing portion, and wherein a bottom surface of the wing portion installed in the recess is coplanar with the bottom surface of the lid body. 4. A device comprising: a die; a thermal interface material disposed on the die; and a lid body including: a bottom surface; a recess formed into the bottom surface; and a wing portion formed into the recess with a gap between a top surface of the wing portion and a surface of the lid body at a top of the recess, wherein the wing portion flexibly moves independently from the lid body, wherein a portion of the lid is arranged above the wing portion, on a side of the wing portion, and wherein a bottom surface of the wing portion installed in the recess is coplanar with the bottom surface of the lid body.
Assignees
Inventors
Classifications
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
between a chip and a stacked insulating package substrate, interposer or RDL · CPC title
on active surfaces of flip-chip devices, e.g. underfills · CPC title
Bump connectors and die-attach connectors · CPC title
Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title
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Frequently asked questions
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- What does patent US10796978B2 cover?
- A heat spreading lid, including a lid body, a wing portion, where the wing portion flexibly moves independently from the lid body.
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H10W40/22. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Oct 06 2020 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).