Axiocentric scrubbing land grid array contacts and methods for fabrication

Patent metadata

Field	Value
Publication number	US-9565759-B2
Application number	US-201514700850-A
Country	US
Kind code	B2
Filing date	Apr 30, 2015
Priority date	Nov 6, 2009
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A contact structure and assembly for a microelectronics device includes first and second electrically conductive contacts being helically shaped. A carrier element is attached to and positioned between the first and second contacts. The first and second contacts are in electrical communication with each other, and the first and second contacts are in a mirror image relationship with each other. A pair of insulating substrates each include electrically conductive members. A contact point on each of the first and second contacts is attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package. A metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

First claim

What is claimed is:

1. A contact assembly for a microelectronics device, comprising:
first and second electrically conductive contacts having defined lengths, both the first and second contacts being helically shaped;
a carrier element attached to and positioned between the first and second contacts, the first and second contacts being in electrical communication with each other, and the first and second contacts being in a mirror image relationship with each other such that a direction of helicity reverses as the first and second contacts pass through the central carrier plane;
a pair of insulating substrates each including electrically conductive members, and at least one contact point on each of the first and second contacts are attached and electrically communicating to respective electrically conductive members such that the first and second electrically conductive contacts between the pair of insulating substrates form an electrically conductive package; and
a separate metal layer on the carrier element provides electrical conductivity through a first opening defined by the carrier element between the first and second portions of the helix shaped contact.

2. The assembly of claim 1 , wherein a second opening defined by the carrier element provides electrical conductivity through the second opening between the first and second portions of the helix shaped contact.

3. The assembly of claim 1 , further comprising:
the first and second electrically conductive contacts between the pair of insulating substrates being in a compressed state relative to an at rest state; and
a rotational displacement of the first and second contacts on the electrically conductive members between the compressed state and the at rest state.

Assignees

• Globalfoundries Inc

Inventors

• Hougham Gareth
• Mcvicker Gerard
• Gu Xiaoxiong
• Kang Sung K
• Libsch Frank R
• Liu Xiao H

Classifications

• H05K3/326

  the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits (H05K3/365 takes precedence) · CPC title

• H05K2201/10378

  Interposers · CPC title

• H05K3/4092

  Integral conductive tabs, i.e. conductive parts partly detached from the substrate · CPC title

• H01R13/2421

  using coil springs · CPC title

• Y10T29/49226

  Electret making · CPC title