Power semiconductor module with rivet or press fit pin and method for fabricating the same
US-12469770-B2 · Nov 11, 2025 · US
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Lis Adrian patents
Lis Adrian is listed as an inventor on 22 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lis Adrian |
| Total patents | 22 |
| First publication | Mar 31, 2022 |
| Latest publication | Nov 11, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Power module having a multi-level metallic frame with power terminals
US-2025259917-A1 · Aug 14, 2025 · US
Power module having vertically aligned first and second substrates
US-12374661-B2 · Jul 29, 2025 · US
Electronic device having a solder stop feature
US-2025233092-A1 · Jul 17, 2025 · US
Package with pad having open notch
US-12334458-B2 · Jun 17, 2025 · US
Solder stop feature for electronic devices
US-12300643-B2 · May 13, 2025 · US
Power module and method of fabricating the same
US-2025096069-A1 · Mar 20, 2025 · US
Semiconductor package having a thermally and electrically conductive spacer
US-12224222-B2 · Feb 11, 2025 · US
Semiconductor package with power electronics carrier having trench spacing adapted for delamination
US-12183667-B2 · Dec 31, 2024 · US
Solder barrier structure for power modules
US-2024413118-A1 · Dec 12, 2024 · US
Recent patents
Latest publications not already listed above.
Lead adapters for semiconductor package
US-12113000-B2 · Oct 8, 2024 · US
Power module having a multi-level lead frame
US-2024304527-A1 · Sep 12, 2024 · US
Semiconductor packages including recesses to contain solder
US-12062589-B2 · Aug 13, 2024 · US
Power module having vertically aligned first and second substrates
US-2024047429-A1 · Feb 8, 2024 · US
Semiconductor package with power electronics carrier having trench spacing adapted for delamination
US-2023245968-A1 · Aug 3, 2023 · US
Semiconductor package having a thermally and electrically conductive spacer
US-2023223312-A1 · Jul 13, 2023 · US
Lead Adapters for Semiconductor Package
US-2023178460-A1 · Jun 8, 2023 · US
Solder stop feature for electronic devices
US-2023170316-A1 · Jun 1, 2023 · US
Power semiconductor module with rivet or press fit pin and method for fabricating the same
US-2023054812-A1 · Feb 23, 2023 · US
Semiconductor module with shaped external contact for reduced crack formation in the encapsulation body
US-2022415732-A1 · Dec 29, 2022 · US
Semiconductor packages including recesses to contain solder
US-2022415745-A1 · Dec 29, 2022 · US
Package with pad having open notch
US-2022102299-A1 · Mar 31, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 22 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W40/255 | 14 |
| H10W74/111 | 11 |
| H10W74/114 | 11 |
| H10W90/701 | 10 |
| H10W90/00 | 9 |