Package with pad having open notch

Patent metadata

Field	Value
Publication number	US-12334458-B2
Application number	US-202117487682-A
Country	US
Kind code	B2
Filing date	Sep 28, 2021
Priority date	Sep 29, 2020
Publication date	Jun 17, 2025
Grant date	Jun 17, 2025

Abstract

A package is disclosed. In one example, the package comprises an electronic component having a first main surface with an electrically conductive first pad. The first pad has an open notch, and a spacer body mounted on the first pad and bridging at least part of the open notch.

First claim

What is claimed is:

1. A package which comprises:
an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch; and
a spacer body mounted on the first pad and bridging at least part of the open notch,
wherein the electronic component has an electrically conductive second pad on the first main surface;
wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad and outside of the open notch of the first pad;
wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape;
wherein the first main surface has an electrically insulating region at the open notch of the first pad; and
wherein the spacer body bridges the open notch of the first pad without direct physical contact with the electrically insulating region.

2. The package according to claim 1 , comprising at least one of the following features:
wherein the spacer body is thermally conductive and/or electrically conductive;
wherein the spacer body is mounted in a thermally conductive and/or electrically conductive manner on the first pad of the electronic component;
wherein the spacer body is mounted on the first pad by one of the group consisting of soldering, sintering, welding and adhering.

3. The package according to claim 1 , wherein the first pad and a mounting surface of the spacer body have different geometrical shapes.

4. The package according to claim 1 , wherein the first pad has a rectangular section connected with a first extension section and a second extension section, the extension sections being mutually spaced by the open notch of the first pad.

5. The package according to claim 4 , wherein the spacer body is mounted on at least part of the rectangular section, at least part of the first extension section and at least part of the second extension section.

6. The package according to claim 1 , wherein a mounting surface of the spacer body is rectangular.

7. The package according to claim 1 , wherein the open notch of the first pad is shaped in accordance with at least one of the group consisting of rounded, trapezoid-shaped, substantially V-shaped, substantially U-shaped, and rectangular shaped.

8. The package according to claim 1 , wherein the electronic component has an electrically conductive third pad on a second main surface opposing the first main surface.

9. The package according to claim 1 , wherein the first pad comprises a single open notch.

10. The package according to claim 1 , wherein the second pad is fully outside of the open notch.

11. A method of manufacturing a package, wherein the method comprises:
providing an electronic component having a first main surface with an electrically conductive first pad, the first pad having an open notch,
mounting a spacer body on the first pad so that the spacer body bridges at least part of the open notch,
wherein the electronic component has an electrically conductive second pad on the first main surface,
wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch of the first pad and outside of the open notch of the first pad,
wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape,
wherein the first main surface has an electrically insulating region at the open notch of the first pad, and
wherein the spacer body bridges the open notch of the first pad without direct physical contact with the electrically insulating region.

12. The method according to claim 11 , wherein the second pad is fully outside of the open notch.

13. A package, comprising:
an electronic component with an electrically conductive first pad having an open notch and with an electrically conductive second pad;
wherein the second pad is arranged so as to be substantially equidistantly spaced from the first pad along the open notch and fully outside of the open notch of the first pad; and
wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.

14. A method of manufacturing the package of claim 1 , wherein the method comprises:
providing an electronic component with an electrically conductive first pad having an open notch and with an electrically conductive second pad;
arranging the second pad so as to be substantially equidistantly spaced from the first pad along the open notch and fully outside of the open notch of the first pad, and
wherein the second pad is shaped in accordance with at least one of the group consisting of a circular shape, a hexagon shape, and an octagon shape.

Assignees

• Infineon Technologies Ag

Inventors

• Lis Adrian

Classifications

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W95/00

  Packaging processes not covered by the other groups of this subclass · CPC title

• H10W72/551

  Materials of bond wires · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/871

  Bond wires and strap connectors · CPC title