Solder stop feature for electronic devices

Patent metadata

Field	Value
Publication number	US-12300643-B2
Application number	US-202117537822-A
Country	US
Kind code	B2
Filing date	Nov 30, 2021
Priority date	Nov 30, 2021
Publication date	May 13, 2025
Grant date	May 13, 2025

Abstract

Described are solder stop features for electronic devices. An electronic device may include an electrically insulative substrate, a metallization on the electrically insulative substrate, a metal structure attached to a first main surface of the metallization via a solder joint, and a concavity formed in a sidewall of the metallization. The concavity is adjacent at least part of the solder joint and forms a solder stop. A first section of the metal structure is spaced apart from both the metallization and solder joint in a vertical direction that is perpendicular to the first main surface of the metallization. A linear dimension of the concavity in a horizontal direction that is coplanar with the metallization is at least twice the distance by which the first section of the metal structure is spaced apart from the first main surface of the metallization in the vertical direction. Additional solder stop embodiments are described.

First claim

What is claimed is:

1. An electronic device, comprising:
an electrically insulative substrate;
a metallization on the electrically insulative substrate;
a metal structure attached to a first main surface of the metallization via a solder joint; and
a concavity formed in a sidewall of the metallization,
wherein the concavity is adjacent at least part of the solder joint,
wherein a first section of the metal structure is spaced apart from both the metallization and the solder joint in a vertical direction that is perpendicular to the first main surface of the metallization,
wherein a linear dimension of the concavity in a horizontal direction that is coplanar with the metallization is at least twice the distance by which the first section of the metal structure is spaced apart from the first main surface of the metallization in the vertical direction.

2. The electronic device of claim 1 , wherein the electrically insulative substrate is an interlayer dielectric formed over a semiconductor substrate, wherein the metallization is patterned into a plurality of contact pads that are separated from one another, and wherein the concavity is formed in the sidewall of one of the contact pads to which the metal structure is attached via the solder joint.

3. The electronic device of claim 1 , wherein the electronic device is a molded semiconductor package, wherein the electrically insulative substrate is a molding compound, wherein at least part of the metallization is exposed from the molding compound, and wherein the concavity is formed in the sidewall of the part of the metallization exposed from the molding compound.

4. The electronic device of claim 1 , wherein the electrically insulative substrate is a ceramic substrate, wherein the metallization is bonded to the ceramic substrate and patterned into a plurality of sections that are separated from one another, and wherein the concavity is formed in the sidewall of a section of the patterned metallization to which the metal structure is attached via the solder joint.

5. The electronic device of claim 1 , wherein the metal structure is a shunt, a thermistor, or a metal clip.

6. The electronic device of claim 1 , wherein a second section of the metal structure is connected to the first section of the metal structure at a first end of the second section, and wherein the second section of the metal structure is attached to the metallization via the solder joint at a second end of the second section opposite the first end.

7. The electronic device of claim 6 , wherein the second section of the metal structure has a transition region over which the height of the second section increases in the vertical direction from a first height at the second end of the second section to a second height at the first end of the second section, and wherein a surface of the transition region that faces the metallization has one or more grooves that prevent the solder joint from reaching the first section of the metal structure.

8. The electronic device of claim 6 , wherein the first section of the metal structure and the second section of the metal structure comprise different materials such that the first section of the metal structure has a lower temperature coefficient between 20 and 60° C. compared to the second section of the metal structure.

Assignees

• Infineon Technologies Ag

Inventors

• Nikitin Ivan
• Lis Adrian
• Scherl Peter
• Althaus Achim

Classifications

• H10W90/701 Primary

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W72/934

  Cross-sectional shape, i.e. in side view · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/926

  Multiple bond pads having different sizes · CPC title

• H10W72/691

  Bond pads specially adapted therefor · CPC title