Electronic device for controlling antenna switching circuit
US-2026045697-A1 · Feb 12, 2026 · US
This page is not indexed by search engines while we improve data quality.
Lee Doohwan patents
Lee Doohwan is listed as an inventor on 58 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Doohwan |
| Total patents | 58 |
| First publication | May 7, 2020 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device and semiconductor package including the same
US-12453107-B2 · Oct 21, 2025 · US
Semiconductor package
US-12388046-B2 · Aug 12, 2025 · US
Electronic device comprising power amplifier, and operating method thereof
US-2025247058-A1 · Jul 31, 2025 · US
Semiconductor package
US-2025192131-A1 · Jun 12, 2025 · US
Methods of manufacturing a fan-out panel level semiconductor package
US-12315822-B2 · May 27, 2025 · US
Switch and electronic device including the same
US-12283446-B2 · Apr 22, 2025 · US
Semiconductor package
US-12243791-B2 · Mar 4, 2025 · US
Semiconductor package
US-12205939-B2 · Jan 21, 2025 · US
Semiconductor package
US-2024312959-A1 · Sep 19, 2024 · US
Recent patents
Latest publications not already listed above.
Electronic device including coupler
US-2024235586-A9 · Jul 11, 2024 · US
Semiconductor package
US-12015014-B2 · Jun 18, 2024 · US
Semiconductor package
US-2024145397-A1 · May 2, 2024 · US
Electronic device including coupler
US-2024137052-A1 · Apr 25, 2024 · US
Electronic device and method for wireless communication
US-11962341-B2 · Apr 16, 2024 · US
Semiconductor package including a through-electrode penetrating a molding part
US-11942458-B2 · Mar 26, 2024 · US
Semiconductor package
US-11901301-B2 · Feb 13, 2024 · US
Fan-out semiconductor package
US-11791230-B2 · Oct 17, 2023 · US
Semiconductor packages
US-11735532-B2 · Aug 22, 2023 · US
Semiconductor package and method of manufacturing the same
US-11721577-B2 · Aug 8, 2023 · US
Catalyst structure having a core-shell structure with a controlled surface morphology and preparation method thereof
US-2023234031-A1 · Jul 27, 2023 · US
Semiconductor package
US-2023223353-A1 · Jul 13, 2023 · US
Semiconductor package
US-11676915-B2 · Jun 13, 2023 · US
Semiconductor device and semiconductor package including the same
US-2023142938-A1 · May 11, 2023 · US
Switch and electronic device including the same
US-2023136122-A1 · May 4, 2023 · US
Semiconductor package
US-2023115073-A1 · Apr 13, 2023 · US
Semiconductor package and method of manufacturing the same
US-2023060618-A1 · Mar 2, 2023 · US
Semiconductor package, and package on package having the same
US-11581263-B2 · Feb 14, 2023 · US
Semiconductor package
US-2022310577-A1 · Sep 29, 2022 · US
Antenna module including communication module capable of determining abnormality of transmission or reception path
US-11444706-B2 · Sep 13, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 57 |
| Univ Seoul Ind Coop Found | 1 |
| Samsung Electronics Co Lt | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/701 | 47 |
| H10W70/60 | 44 |
| H10W70/65 | 42 |
| H10W70/614 | 41 |
| H10W70/685 | 41 |