Etched facet in a multi quantum well structure
US-2025298185-A1 · Sep 25, 2025 · US
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Lambert Damien patents
Lambert Damien is listed as an inventor on 46 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lambert Damien |
| Total patents | 46 |
| First publication | Apr 12, 2016 |
| Latest publication | Sep 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Etched facet in a multi quantum well structure
US-12253714-B2 · Mar 18, 2025 · US
Broadband back mirror for a photonic chip
US-12210186-B2 · Jan 28, 2025 · US
Etched facet in a multi quantum well structure
US-2023358951-A1 · Nov 9, 2023 · US
Broadband back mirror for a photonic chip
US-2023341620-A1 · Oct 26, 2023 · US
Etched facet in a multi quantum well structure
US-11624872-B2 · Apr 11, 2023 · US
Broadband back mirror for a photonic chip
US-11585977-B2 · Feb 21, 2023 · US
Waveguide mode expander having non-crystalline silicon features
US-11409039-B2 · Aug 9, 2022 · US
Etched facet in a multi quantum well structure
US-2022196911-A1 · Jun 23, 2022 · US
On-chip high capacitance termination for transmitters
US-11307440-B2 · Apr 19, 2022 · US
Recent patents
Latest publications not already listed above.
Etched facet in a multi quantum well structure
US-11194092-B2 · Dec 7, 2021 · US
Stepped optical bridge for connecting semiconductor waveguides
US-11002907-B2 · May 11, 2021 · US
Waveguide mode expander having non-crystalline silicon features
US-2021116640-A1 · Apr 22, 2021 · US
Broadband back mirror for a iii-v chip in silicon photonics
US-2021116636-A1 · Apr 22, 2021 · US
Integrated photonics mode expander
US-10895686-B2 · Jan 19, 2021 · US
On-chip high capacitance termination for transmitters
US-2020371383-A1 · Nov 26, 2020 · US
Waveguide mode expander having non-crystalline silicon features
US-10768369-B2 · Sep 8, 2020 · US
Broadband back mirror for a III-V chip in silicon photonics
US-10732349-B2 · Aug 4, 2020 · US
Etched facet in a multi quantum well structure
US-2020233150-A1 · Jul 23, 2020 · US
On-chip high capacitance termination for transmitters
US-10678073-B2 · Jun 9, 2020 · US
Waveguide mode expander having non-crystalline silicon features
US-2020124797-A1 · Apr 23, 2020 · US
Iii-v chip preparation and integration in silicon photonics
US-2020083662-A1 · Mar 12, 2020 · US
Stepped optical bridge for connecting semiconductor waveguides
US-2019384002-A1 · Dec 19, 2019 · US
Method of modifying mode size of an optical beam, using a waveguide mode expander having non-crystalline silicon features
US-10345521-B2 · Jul 9, 2019 · US
Micro-pillar assisted semiconductor bonding
US-10319693-B2 · Jun 11, 2019 · US
III-V chip preparation and integration in silicon photonics
US-10312661-B2 · Jun 4, 2019 · US
Stepped optical bridge for connecting semiconductor waveguides
US-10234626-B2 · Mar 19, 2019 · US
Waveguide mode expander having an amorphous-silicon shoulder
US-2018364416-A1 · Dec 20, 2018 · US
Integrated photonics mode expander
US-2018348432-A1 · Dec 6, 2018 · US
Back side via vertical output couplers
US-10132996-B2 · Nov 20, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Skorpios Tech Inc | 45 |
| Infinera Corp | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G02B2006/12061 | 37 |
| G02B6/136 | 37 |
| G02B2006/12147 | 24 |
| G02B6/12004 | 21 |
| G02B6/122 | 20 |