Optimal scanner maps and field layouts
US-2024319579-A1 · Sep 26, 2024 · US
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Lallement Romain patents
Lallement Romain is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lallement Romain |
| Total patents | 19 |
| First publication | Feb 7, 2019 |
| Latest publication | Sep 26, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of making euv mask with an absorber layer
US-2023280644-A1 · Sep 7, 2023 · US
Transistor structure with N/P boundary buffer
US-11569132-B2 · Jan 31, 2023 · US
Self aligned block masks for implantation control
US-11177132-B2 · Nov 16, 2021 · US
Transistor structure with n/p boundary buffer
US-2021118743-A1 · Apr 22, 2021 · US
Transistor structure with n/p boundary buffer
US-10903124-B2 · Jan 26, 2021 · US
Self aligned block masks for implantation control
US-2021005459-A1 · Jan 7, 2021 · US
Measuring and modeling material planarization performance
US-10832919-B2 · Nov 10, 2020 · US
Transistor structure with n/p boundary buffer
US-2020350212-A1 · Nov 5, 2020 · US
Verifying planarization performance using electrical measures
US-10642950-B2 · May 5, 2020 · US
Recent patents
Latest publications not already listed above.
Planarization depth triggered by process interaction
US-2020118828-A1 · Apr 16, 2020 · US
Resist multilayer film-attached substrate and patterning process
US-10514605-B2 · Dec 24, 2019 · US
Methods of forming merged source/drain regions on integrated circuit products
US-10475904-B2 · Nov 12, 2019 · US
Measuring and modeling material planarization performance
US-2019318935-A1 · Oct 17, 2019 · US
Verifying planarization performance using electrical measures
US-2019243927-A1 · Aug 8, 2019 · US
Simplified block patterning with wet strippable hardmask for high-energy implantation
US-10354922-B1 · Jul 16, 2019 · US
Methods of forming merged source/drain regions on integrated circuit products
US-2019214484-A1 · Jul 11, 2019 · US
Simplified block patterning with wet strippable hardmask for high-energy implantation
US-2019198398-A1 · Jun 27, 2019 · US
Resist multilayer film-attached substrate and patterning process
US-2019041753-A1 · Feb 7, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| IBM | 17 |
| Globalfoundries Inc | 2 |
| Shinetsu Chemical Co | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 10 |
| H10D84/85 | 8 |
| H10D30/43 | 6 |
| H10D30/014 | 6 |
| B82Y10/00 | 6 |