Liquid cooled module for narrow pitch slots
US-2025338455-A1 · Oct 30, 2025 · US
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Kulkarni Devdatta P patents
Kulkarni Devdatta P is listed as an inventor on 30 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kulkarni Devdatta P |
| Total patents | 30 |
| First publication | Nov 2, 2017 |
| Latest publication | Oct 30, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Compact form factor fluid flow regulator
US-2025285939-A1 · Sep 11, 2025 · US
Cooling mass and spring element for low insertion force hot swappable electronic component interface
US-2025024647-A1 · Jan 16, 2025 · US
Cooling mass and spring element for low insertion force hot swappable electronic component interface
US-12133368-B2 · Oct 29, 2024 · US
Heat transfer apparatus for a computer environment
US-12093092-B2 · Sep 17, 2024 · US
Thin form factor assemblies for cooling dimms
US-2022225542-A1 · Jul 14, 2022 · US
Cooling mass and spring element for low insertion force hot swappable electronic component interface
US-2022210952-A1 · Jun 30, 2022 · US
Heat transfer apparatus for a computer environment
US-2022137685-A1 · May 5, 2022 · US
Heat transfer apparatus for a computer environment
US-11249522-B2 · Feb 15, 2022 · US
Liquid cooled module for narrow pitch slots
US-2021321543-A1 · Oct 14, 2021 · US
Recent patents
Latest publications not already listed above.
Computing apparatus with closed cooling loop
US-11026351-B2 · Jun 1, 2021 · US
Mechanism with folded wrapping to seal components immersed in coolant
US-10945353-B2 · Mar 9, 2021 · US
Two-phase liquid-vapor computer cooling device
US-10765039-B2 · Sep 1, 2020 · US
Computing apparatus with closed cooling loop
US-2020245511-A1 · Jul 30, 2020 · US
Thermal management component
US-10727160-B2 · Jul 28, 2020 · US
Hydraulic bladder for CPU interconnection and cooling
US-10455731-B2 · Oct 22, 2019 · US
Thermal management component
US-2019206764-A1 · Jul 4, 2019 · US
Methods of direct cooling of packaged devices and structures formed thereby
US-2019094925-A1 · Mar 28, 2019 · US
Methods of direct cooling of packaged devices and structures formed thereby
US-10228735-B2 · Mar 12, 2019 · US
Methods of direct cooling of packaged devices and structures formed thereby
US-2019004573-A1 · Jan 3, 2019 · US
Cooling using adjustable thermal coupling
US-10168749-B2 · Jan 1, 2019 · US
Two-phase liquid-vapor computer cooling device
US-2018343773-A1 · Nov 29, 2018 · US
Cooling using a wick with varied thickness
US-2018270993-A1 · Sep 20, 2018 · US
Hydraulic bladder for cpu interconnection and cooling
US-2018263137-A1 · Sep 13, 2018 · US
System with provision of a thermal interface to a printed circuit board
US-10074591-B1 · Sep 11, 2018 · US
System with provision of a thermal interface to a printed circuit board
US-2018254237-A1 · Sep 6, 2018 · US
Tunable two phase liquid cooling thermal management method and apparatus
US-9983641-B2 · May 29, 2018 · US
Cooling using coolant-driven fans
US-2018066663-A1 · Mar 8, 2018 · US
Heat transfer apparatus for a computer environment
US-2018004259-A1 · Jan 4, 2018 · US
Tunable two phase liquid cooling thermal management method and apparatus
US-2017315595-A1 · Nov 2, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 30 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F1/20 | 16 |
| G06F2200/201 | 13 |
| H05K7/20772 | 9 |
| H05K7/20809 | 7 |
| H05K1/0203 | 7 |