Mechanism with folded wrapping to seal components immersed in coolant

Patent metadata

Field	Value
Publication number	US-10945353-B2
Application number	US-201715711468-A
Country	US
Kind code	B2
Filing date	Sep 21, 2017
Priority date	Sep 21, 2017
Publication date	Mar 9, 2021
Grant date	Mar 9, 2021

Abstract

Embodiments described herein may include apparatuses, systems and/or processes to provide a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink. The mechanism with the folded wrapping may be dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink. On enclosing and sealing the volume, the mechanism with the folded wrapping may keep coolant from reaching the one or more processors when the circuit board, the mechanism, and the heatsink are immersed in the coolant. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. An apparatus, comprising:
a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink;
wherein the mechanism with the folded wrapping is dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink; and
wherein on enclosing and sealing the volume, the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.

2. The apparatus of claim 1 , wherein the folded wrapping has geometries complementary to geometries of the heatsink.

3. The apparatus of claim 1 , wherein the folded wrapping is made of plastic polymers, metal foils, or coated polymer.

4. The apparatus of claim 1 , further comprising a sealing cap dimensioned to be secured over a top of the heatsink to overlap an edge surrounding the heatsink, wherein an opening of the mechanism is secured under the sealing cap to form a seal with the heatsink.

5. The apparatus of claim 1 , further comprising adhesive sealant disposed between an opening of the mechanism and the circuit board.

6. The apparatus of claim 1 , further comprising adhesive sealant disposed between an opening of the mechanism and an edge surrounding the heatsink.

7. The apparatus of claim 1 , further comprising the circuit board, the one or more processors, the heatsink, a sealing cap, and adhesive sealant disposed between an opening of the mechanism with the folded wrapping and the sealing cap, wherein the sealing cap is dimensioned to be secured over a top of the heatsink to overlap an edge surrounding the heatsink, wherein the opening of the mechanism with the folded wrapping is secured under the sealing cap to form a seal with the heatsink.

8. The apparatus of claim 1 , wherein the mechanism with the folded wrapping is dimensioned to enclose and seal the volume, with the volume having a size to further accommodate a thermal interface material (TIM), package sealant, or socket.

9. A method, comprising:
adhering a first end of a mechanism with folded wrapping to a motherboard to form a seal with the motherboard;
adhering a second end of the mechanism with the folded wrapping to an edge of a heatsink to form a seal with the edge of the heatsink;
wherein the mechanism with the folded wrapping is to enclose and seal a volume between the motherboard and the heatsink where the volume includes one or more processors; and
wherein the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.

10. The method of claim 9 , further comprising folding the folded wrapping to a geometry complementary to geometries of the heatsink.

11. The method of claim 9 , wherein the folded wrapping is made of plastic polymers, metal foils, or coated polymer.

12. The method of claim 9 , further comprising securing a sealing cap on a top of the heatsink to overlap an edge surrounding the heatsink, wherein an opening of the folded wrapping is secured under the sealing cap to form a seal with the heatsink.

13. A system, comprising:
a circuit board;
a heatsink; and
a mechanism with a folded wrapping to mate with a circuit board and a heatsink to enclose and seal a volume between the circuit board and the heatsink;
wherein the mechanism with the folded wrapping is dimensioned to enclose and seal the volume with the volume having a size to accommodate one or more processors to be disposed within the volume, electrically coupled to the circuit board and thermally coupled to the heatsink; and
wherein on enclosing and sealing the volume, the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.

14. The system of claim 13 , wherein the folded wrapping has geometries complementary to geometries of the heatsink.

15. The system of claim 13 , wherein the folded wrapping is made of plastic polymers, metal foils, or coated polymer.

16. The system of claim 13 , further comprising a sealing cap dimensioned to be secured over a top of the heatsink to overlap an edge surrounding the heatsink, wherein an opening of the mechanism is secured under the sealing cap to form a seal with the heatsink.

17. The system of claim 13 , further comprising the circuit board, the one or more processors, the heatsink, a sealing cap, and adhesive sealant disposed between an opening of the mechanism with the folded wrapping and the sealing cap, wherein the sealing cap is dimensioned to be secured over a top of the heatsink to overlap an edge surrounding the heatsink, wherein the opening of the mechanism with the folded wrapping is secured under the sealing cap to form a seal with the heatsink.

18. The system of claim 13 , wherein the mechanism with the folded wrapping is dimensioned to enclose and seal the volume, with the volume having a size to further accommodate a thermal interface material (TIM), package sealant, or socket.

19. The system of claim 13 , further including at least one of a central processing unit (CPU), CPU package, socket, loading/retention mechanism, or thermal interface material (TIM).

20. An apparatus, comprising:
means for adhering a first end of a mechanism with folded wrapping to a motherboard to form a seal with the motherboard;
means for adhering a second end of the mechanism with the folded wrapping to an edge of a heatsink to form a seal with the edge of the heatsink;
wherein the mechanism with the folded wrapping is to enclose and seal a volume between the motherboard and the heatsink where the volume includes one or more processors; and
wherein the mechanism with the folded wrapping prevents coolant from reaching the one or more processors.

21. The apparatus of claim 20 , further comprising means for folding the folded wrapping to a geometry complementary to geometries of the heatsink.

22. The apparatus of claim 20 , wherein the folded wrapping is made of plastic polymers, metal foils, or coated polymer.

23. The apparatus of claim 20 , further comprising means for securing a sealing cap on a top of the heatsink to overlap an edge surrounding the heatsink, wherein an opening of the folded wrapping is secured under the sealing cap to form a seal with the heatsink.

Assignees

• Intel Corp

Inventors

• Faneuf Barrett M
• Chen Annie
• Gulbrand Jessica
• Kulkarni Devdatta P
• Weldon Kristin L
• Broderick Joseph Andrew

Classifications

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H05K7/20236 Primary

  by immersion · CPC title

• H05K7/20772

  within server blades for removing heat from heat source · CPC title

• H05K3/22

  Secondary treatment of printed circuits {(H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107)} · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title