Cooling mass and spring element for low insertion force hot swappable electronic component interface

Patent metadata

Field	Value
Publication number	US-12133368-B2
Application number	US-202217697877-A
Country	US
Kind code	B2
Filing date	Mar 17, 2022
Priority date	Nov 10, 2021
Publication date	Oct 29, 2024
Grant date	Oct 29, 2024

Abstract

An apparatus is described. The apparatus includes a cooling mass. The apparatus includes a cooling block having an opening to receive a portion of the cooling mass. The apparatus having a spring element to be rotated about an axis of rotation. An obstruction between a hot pluggable electronic component and an electro-mechanical connector is to be removed by the spring element's rotation. The cooling mass is to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

First claim

The invention claimed is:

1. An apparatus, comprising:
a cooling mass;
a cooling block including an opening to receive a portion of the cooling mass; and
a spring element to be rotated about an axis of rotation, an obstruction between a hot pluggable electronic component and an electro-mechanical connector to be removed by the spring element's rotation, the cooling mass to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

2. The apparatus of claim 1 wherein the cooling mass is a heat spreader.

3. The apparatus of claim 2 wherein the cooling block is a cold plate having at least one cool fluid input and at least one warm fluid output.

4. The apparatus of claim 1 wherein the cooling mass is a vapor chamber.

5. The apparatus of claim 1 wherein the spring element includes a lever arm that creates a torque about the axis of rotation as the obstruction is being overcome.

6. The apparatus of claim 1 wherein the axis of rotation runs along a pin that runs parallel with a backplane that the electro-mechanical connector is mounted to.

7. The apparatus of claim 1 wherein the axis of rotation is at the opening.

8. An electronic system, comprising:
an electro-mechanical connector to receive a hot pluggable electronic component;
a cooling mass;
a cooling block including an opening to receive a portion of the cooling mass; and
a spring element to be rotated about an axis of rotation, an obstruction between the hot pluggable electronic component and the electro-mechanical connector to be removed by the spring element's rotation, the cooling mass to be pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

9. The electronic system of claim 8 wherein the cooling mass is a heat spreader.

10. The electronic system of claim 8 wherein the cooling mass is a vapor chamber.

11. The electronic system of claim 8 wherein the spring element includes a lever arm that creates a torque about the axis of rotation as the obstruction is being overcome.

12. The electronic system of claim 8 wherein the axis of rotation runs along a pin that runs parallel with a backplane that the electro-mechanical connector is mounted to.

13. The electronic system of claim 8 wherein the axis of rotation is at the opening.

14. The electronic system of claim 8 wherein the electro-mechanical connector is a PCIe connector.

15. A data center, comprising:
a heat exchanger; and
a plurality of racks, the plurality of racks respectively including installed electronic systems, the respectively installed electronic systems communicatively coupled by one or more networks, wherein, one of the respectively installed electronic systems includes a), b), c), d), and e) below:
a) an electro-mechanical connector;
b) a hot pluggable electronic component that is plugged into the electro-mechanical connector;
c) a cooling mass;
d) a cooling block including an opening to receive a portion of the cooling mass, the cooling block having an input port that receives cooled fluid from the heat exchanger and an exit port that sends warmed fluid to the heat exchanger; and
e) a spring element rotated about an axis of rotation, an obstruction between the hot pluggable electronic component and the electro-mechanical connector removed by the spring element's rotation, the cooling mass pressed toward the hot pluggable electronic component in response to a force induced by the spring element's rotation.

16. The data center of claim 15 wherein the spring element includes a lever arm that creates a torque about the axis of rotation when the obstruction is being overcome.

17. The data center of claim 16 wherein the axis of rotation runs along a pin that runs parallel with a backplane that the electro-mechanical connector is mounted to.

18. The data center of claim 16 wherein the axis of rotation is at the opening.

19. The data center of claim 15 wherein the electro-mechanical connector is a PCIe connector and the hot pluggable electronic component is a solid state drive (SSD).

Assignees

• Intel Corp

Inventors

• Singh Hardeep
• Sharma Rachit
• Hanna Timothy Glen
• Kulkarni Devdatta P

Classifications

• H05K7/2049

  Pressing means used to urge contact, e.g. springs · CPC title

• H05K7/20263

  Heat dissipaters releasing heat from coolant · CPC title

• H05K7/20254

  Cold plates transferring heat from heat source to coolant · CPC title

• H05K7/1489

  characterized by the mounting of blades therein, e.g. brackets, rails, trays (H05K7/1491 takes precedence) · CPC title

• H05K7/20772 Primary

  within server blades for removing heat from heat source · CPC title