System with provision of a thermal interface to a printed circuit board

Patent metadata

Field	Value
Publication number	US-10074591-B1
Application number	US-201715448120-A
Country	US
Kind code	B1
Filing date	Mar 2, 2017
Priority date	Mar 2, 2017
Publication date	Sep 11, 2018
Grant date	Sep 11, 2018

Abstract

Embodiments of the present disclosure provide techniques and configurations for providing a thermal interface to a PCB. In some embodiments, the system for providing a thermal interface to a PCB may include a heat sink couplable to a printed circuit board (PCB) via a thermal interface. The heat sink may include a base configured to accommodate a plurality of heat pipes. The system may further include a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. A system, comprising:
a heat sink couplable to a printed circuit board (PCB) via a thermal interface, wherein the thermal interface comprises a thermal interface material (TIM), wherein the TIM includes a thermal conductive soldered paste, wherein the heat sink includes a base, wherein the base is to accommodate a plurality of heat pipes; and
a heater block couplable to the base with the plurality of heat pipes, to conduct heat generated by the heater block to the base via the plurality of heat pipes, to heat the thermal interface, and cause the thermal interface to spread substantially evenly between the heat sink and the PCB, wherein the heat pipes conduct the heat to the base to cause the paste to reflow, to reduce thermal resistance between at least a portion of the PCB and the heat sink, in response to a coupling of the heat sink to the portion of the PCB.

2. The system of claim 1 , wherein the base includes a plurality of receptors to receive respective heat pipes of the plurality of heat pipes.

3. The system of claim 2 , wherein the heat pipes are attached to the heater block, wherein the heat pipes have respective extended portions that extend out of the heater block and wherein the heater block is removably attachable to the base via the extended portions of the heat pipes.

4. The system of claim 2 , wherein the plurality of receptors comprises multiple grooves provided on a surface of a side of the base that is to face the thermal interface, in response to attachment of the heat sink to the PCB.

5. The system of claim 2 , wherein the plurality of receptors comprises multiple holes disposed in a side of the base that is to face the thermal interface, in response to attachment of the heat sink to the PCB.

6. The system of claim 1 , wherein the heat pipes are attached to the base, wherein the heat pipes have respective extended portions that extend out of the base, and wherein the heater block is removably attachable to the base via the extended portions of the heat pipes.

7. The system of claim 1 , further comprising:
a socket disposed in the portion of the PCB;
a substrate disposed in the socket; and
an integrated circuit with an integrated heat spreader (IHS) disposed on the substrate, wherein the thermal interface material is disposed on the IHS, to provide the thermal interface between the heat sink and the integrated circuit, in response to the coupling of the heat sink to the portion of the PCB.

8. The system of claim 7 , wherein the PCB comprises a motherboard, wherein the integrated circuit comprises a central processing unit (CPU).

9. The system of claim 1 , wherein the heat pipes are to operate at a temperature equal to or exceeding 200 degrees Celsius.

10. A method, comprising:
disposing a thermal interface between a printed circuit board (PCB) and a heat sink, the thermal interface comprising a thermal interface material (TIM), wherein the TIM includes a thermal conductive soldered paste;
attaching a heater block to a base of the heat sink via a plurality of heat pipes couplable to the heater block and the heat sink; and
applying heat to the thermal interface, wherein applying heat includes causing the heat pipes of the heater block to provide heat to the base to cause the paste to reflow, to provide a soldering of the thermal interface, to cause a substantially even spreading of the thermal interface between the base and the PCB and to reduce thermal resistance between at least a portion of the PCB and the heat sink, in response to a coupling of the heat sink to the portion of the PCB.

11. The method of claim 10 , further comprising: attaching the heat sink to the PCB.

12. The method of claim 10 , wherein providing the thermal interface includes:
providing a substrate;
disposing an integrated circuit with an integrated heat spreader (IHS) on the substrate; and
disposing a thermal interface material on the IHS or on a side of the heat sink facing the IHS.

13. The method of claim 12 , further comprising: disconnecting the heater block from the base.

14. The method of claim 10 , wherein the heat pipes are attached to the base, wherein coupling a heater block to a base of the heat sink via a plurality of heat pipes includes connecting the heater block to the heat pipes.

15. The method of claim 10 , wherein the heat pipes are attached to the heater block, wherein coupling a heater block to a base of the heat sink via a plurality of heat pipes includes connecting the heat pipes to the base.

Assignees

• Intel Corp

Inventors

• Kulkarni Devdatta P
• Aoki Russell S

Classifications

• H10W78/00

  Detachable holders for supporting packaged chips in operation · CPC title

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• F28D15/0275 Primary

  Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores · CPC title

• F28D15/0266

  with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers (F28D15/043 takes precedence) · CPC title