Liquid cooled module for narrow pitch slots

Patent metadata

Field	Value
Publication number	US-2021321543-A1
Application number	US-202117357776-A
Country	US
Kind code	A1
Filing date	Jun 24, 2021
Priority date	Jun 24, 2021
Publication date	Oct 14, 2021
Grant date	—

Abstract

An apparatus is described. The apparatus includes a module to be inserted into an electronic system. The module includes a first heat exchanger at one end of the module and second heat exchanger at another end of the module. The module also includes a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module. The first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

First claim

1 . An apparatus,
a module to be inserted into an electronic system, the module comprising: a) a first heat exchanger at one end of the module and second heat exchanger at another end of the module; and, b) a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module, wherein, the first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

2 . The apparatus of claim 1 wherein the first and second vapor chambers are closed vapor chambers.

3 . The apparatus of claim 2 wherein a thermal interface material is disposed between the first heat exchanger at the least one of the first and second vapor chambers that the first heat exchanger is in thermal contact with.

4 . The apparatus of claim 1 wherein the first and second vapor chambers are open vapor chambers.

5 . The apparatus of claim 4 further comprising at least one respective fluidic channel between the at least one of the first and second vapor chambers that the first heat exchanger is in thermal contact with.

6 . The apparatus of claim 1 further comprising a thermal interface material between the first vapor chamber and the respective integrated heat spreaders of the semiconductor chips disposed on the first side of the module.

7 . The apparatus of claim 1 wherein the first heat exchanger is mechanically integrated with the first vapor chamber such that no thermal interface material exists between the first heat exchanger and the first vapor chamber.

8 . The apparatus of claim 1 wherein an inner face of the first heat exchanger is in thermal contact with a respective outer face of the at least one of the first and second vapor chambers that the first exchanger is in thermal contact with.

9 . The apparatus of claim 1 where the first and second heat exchangers are to be in thermal contact with first and second cold plates of the electronic system.

10 . The apparatus of claim 1 where the module is a memory module.

11 . The apparatus of claim 1 wherein at least one of the first and second vapor chambers collapses and expands as a function of heat received from its respective ones of the semiconductor chips.

12 . A computing system, comprising:
a plurality of processing cores; a memory controller coupled to the processing cores; a liquid cooling system; a main memory coupled to the memory controller, the main memory comprising a memory module, the module comprising: a) a first heat exchanger at one end of the memory module coupled to a first cold plate of the liquid cooling system and second heat exchanger at another end of the memory module, coupled to a second cold plate of the liquid cooling system; and, b) a first vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a first side of the module and a second vapor chamber that runs along respective integrated heat spreaders of semiconductor chips disposed on a second side of the module, wherein, the first heat exchanger is in thermal contact with at least one of the first and second vapor chambers, and, the second heat exchanger is in thermal contact with at least one of the first and second vapor chambers.

13 . The computing system of claim 12 wherein the first and second vapor chambers are closed vapor chambers.

14 . The computing system of claim 12 wherein the first and second vapor chambers are open vapor chambers.

15 . The computing system of claim 12 further comprising a thermal interface material between the first vapor chamber and the respective integrated heat spreaders of the semiconductor chips disposed on the first side of the module.

16 . The computing system of claim 12 wherein the first heat exchanger is mechanically integrated with the first vapor chamber such that no thermal interface material exists between the first heat exchanger and the first vapor chamber.

17 . The computing system of claim 12 wherein an inner face of the first heat exchanger is in thermal contact with a respective outer face of the at least one of the first and second vapor chambers that the first exchanger is in thermal contact with.

18 . The computing system of claim 12 where the first and second heat exchangers are to be in thermal contact with first and second cold plates of the electronic system.

19 . The computing system of claim 11 where the module is a memory module.

20 . A method, comprising:
operating a module having first semiconductor chips disposed on a first side of the module and having second semiconductor chips disposed on a second side of the module; vaporizing first liquid in a first vapor chamber that is in thermal contact with the first semiconductor chips and vaporizing second liquid in a second vapor chamber that is in thermal contact with the second semiconductor chips; condensing the vaporized first and second liquids in first and second heat exchangers that are disposed at ends of the module.

Assignees

• Intel Corp

Inventors

• Tan Guixiang
• Li Xiang
• Chuang Jimmy
• Kulkarni Devdatta P
• Winkel Casey
• Chenelly Evan A

Classifications

• G06F1/20

  Cooling means · CPC title

• G06F1/185

  Mounting of expansion boards · CPC title

• G11C5/04

  Supports for storage elements {, e.g. memory modules}; Mounting or fixing of storage elements on such supports · CPC title

• H05K7/20336 Primary

  Heat pipes, e.g. wicks or capillary pumps · CPC title

• H05K7/20509

  Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures · CPC title