Two-phase liquid-vapor computer cooling device

Patent metadata

Field	Value
Publication number	US-10765039-B2
Application number	US-201715605802-A
Country	US
Kind code	B2
Filing date	May 25, 2017
Priority date	May 25, 2017
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

Embodiments herein relate to multi-phase cooling of electronic equipment such as processors and voltage regulators in a rack computing system. In various embodiments, a cooling device may include a heat exchanger, an inlet manifold, an outlet manifold, one or more fluid conductors coupled with the heat exchange, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger, and one or more fans to generate a flow of air against the heat exchanger. In some embodiments, the heat exchanger may be arranged in an inverted-V or an inverted-W configuration with respect to the fans. In embodiments, the cooling device may be disposed in a rack module. Other embodiments may be described and/or claimed.

First claim

What is claimed is:

1. A cooling device comprising:
a heat exchanger;
an inlet manifold;
an outlet manifold;
one or more fluid conductors coupled with the heat exchanger, the inlet manifold, and the outlet manifold to carry a two-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger;
one or more fans to generate a flow of air against the heat exchanger, wherein the heat exchanger is arranged in an inverted-V formation or an inverted-W formation in relation to the one or more fans;
a phase separator coupled with the inlet manifold to separate a liquid phase and a vapor phase of a two-phase liquid-vapor mixture;
a compressor disposed upstream of the heat exchanger, and coupled with the phase separator to compress vapor from the phase separator; and
a capillary directly coupled with the compressor to provide a compressed vapor transmission path downstream of the heat exchanger, bypassing the heat exchanger, to lower a pressure level of compressed vapor from the compressor.

2. The cooling device of claim 1 , further comprising:
one or more three-way valves coupled with one or more of the phase separator and the capillary.

3. The cooling device of claim 1 , further comprising:
a sensor to sense a physical characteristic of the two-phase liquid-vapor mixture;
one or more pumps coupled with one or more of the one or more fluid conductors to pump the two-phase liquid-vapor mixture; and
a controller to control the one or more pumps and the one or more fans based at least in part on the physical characteristic.

4. The cooling device of claim 3 , wherein the physical characteristic is a flow rate or a temperature of the two-phase liquid-vapor mixture.

5. The cooling device of claim 4 , wherein the controller is to calculate a vapor quality level of the two-phase liquid-vapor mixture based at least in part on the physical characteristic and the controller is to control the one or more pumps and the one or more fans to maintain the vapor quality level within a predetermined range.

6. The cooling device of claim 1 , further comprising a refrigerant fluid in the one or more fluid conductors.

7. The cooling device of claim 6 , wherein the refrigerant fluid is R134a or HFO 1234yf.

8. The cooling device of claim 1 , further comprising a reservoir coupled with one or more of the one or more fluid conductors.

9. A rack module comprising:
a cooling unit that includes:
a heat exchanger;
one or more fluid conductors coupled with the heat exchanger to carry a multi-phase fluid to be received from N nodes through the heat exchanger; and
a phase separator coupled with an inlet manifold to separate a liquid phase and a vapor phase of the multi-phase fluid;
a compressor disposed upstream of the heat exchanger coupled with the phase separator to compress vapor from the phase separator;
a capillary directly coupled with the compressor to provide a compressed vapor transmission path downstream of the heat exchanger to lower a pressure level of compressed vapor from the compressor, and wherein the phase separator is to be activated or deactivated by a controller based upon a sensed physical characteristic of the multi-phase fluid; and

a chassis, wherein the cooling unit is disposed in the chassis, and wherein the rack module is to cool the N nodes, and is to be disposed in a rack with M other rack modules to cool greater than N but less than or equal to N(1+M) nodes.

10. The rack module of claim 9 , wherein the chassis has a width of approximately 19 inches or approximately 23 inches.

11. The rack module of claim 10 , wherein the heat exchanger is arranged in the chassis in an inverted-V formation or an inverted-W formation in relation to one or more fans.

12. The rack module of claim 9 , wherein the multi-phase fluid is a 2-phase liquid-vapor mixture; and
wherein the phase separator and the compressor are disposed in the chassis.

13. The rack module of claim 9 , further comprising a refrigerant fluid in the one or more fluid conductors.

14. The rack module of claim 9 , wherein the cooling unit further includes:
an inlet manifold;
an outlet manifold; and
one or more quick disconnects on the inlet manifold and the outlet manifold, wherein the one or more fluid conductors are to carry the multi-phase fluid from the outlet manifold to the inlet manifold through the heat exchanger.

15. The rack module of claim 9 , further comprising one or more node units disposed in the chassis.

16. The rack module of claim 15 , wherein the one or more node units include a plurality of computing devices arranged in a blade configuration with a height of approximately 4 rack units (U), wherein the chassis has a height of approximately 6 U.

17. The rack module of claim 15 , wherein the one or more node units include:
a first node unit having 4 nodes; and
a second node unit having 4 nodes, wherein the first node unit has a height of approximately 2 U, the second node unit has a height of approximately 2 U, the cooling unit has a height of approximately 2 U, and the chassis has a height of approximately 6 U.

18. A rack system comprising:
a rack;
a set of nodes disposed in the rack; and
a cooling module that includes:
a cooling unit to cool the set of nodes having:
a heat exchanger;
one or more fluid conductors coupled with the heat exchanger to carry a two-phase liquid-vapor mixture through the heat exchanger;
one more fans to generate a flow of air obliquely against the heat exchanger, wherein the heat exchanger is arranged in an inverted-V formation or an inverted-W formation in relation to the one or more fans;
a phase separator coupled with an inlet manifold to separate a liquid phase and a vapor phase of the multi-phase liquid-vapor mixture;
a compressor disposed upstream of the heat exchanger coupled with the phase separator to compress vapor from the phase separator; and
a capillary directly coupled with the compressor to provide a compressed vapor transmission path downstream of the heat exchanger to lower a pressure level of compressed vapor from the compressor; and

a chassis, wherein the cooling unit is disposed in the chassis and the chassis is disposed in the rack.

19. The rack system of claim 18 , wherein the cooling module is a first cooling module, the set of nodes is a first set of nodes, and the rack system further comprises:
one or more additional sets of nodes disposed in the rack; and
one or more additional cooling modules to cool the one or more additional sets of nodes, wherein the one or more additional cooling modules each include:
a cooling unit having:
a heat exchanger;
one or more fluid conductors coupled with the heat exchanger to carry a two-phase liquid-vapor mixture through the heat exchanger; and
one or more fans to generate a flow of air against the heat exchanger; and

a chassis, wherein the cooling unit is disposed in the chassis and the chassis is disposed in the rack such that two or more cooling modules are disposed in the rack.

20. The rack system of claim 19 , wherein the rack is to receive modules with a width of approximately 19 inches or approximately 23 inches and the two or more cooling modules have a width of approximately 19 inches or approximately 23 inches.

21. The rack system of claim 20 , wherein each cooling unit of the two or more computer cooling modules has a height of approximately 2 rack units (U).

22. The rack system of claim 21 , wherein each cooling unit further includes:

Assignees

• Intel Corp

Inventors

• Kulkarni Devdatta P
• Tang Xudong

Classifications

• H05K7/20327

  Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds · CPC title

• H05K7/20727

  within server blades for removing heat from heat source · CPC title

• H05K7/20809 Primary

  within server blades for removing heat from heat source · CPC title