Bond-to-Bond Die Interface
US-2026079553-A1 · Mar 19, 2026 · US
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Kolor Sergio patents
Kolor Sergio is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kolor Sergio |
| Total patents | 40 |
| First publication | Mar 26, 2015 |
| Latest publication | Mar 19, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Multiple independent on-chip interconnect
US-12561267-B2 · Feb 24, 2026 · US
Segment to Segment Network Interface
US-2026046261-A1 · Feb 12, 2026 · US
Scalable System on a Chip
US-2026044451-A1 · Feb 12, 2026 · US
Communication Fabric Structures for Increased Bandwidth
US-2026019382-A1 · Jan 15, 2026 · US
Segment to segment network interface
US-12463920-B2 · Nov 4, 2025 · US
Communication fabric structures for increased bandwidth
US-12401605-B2 · Aug 26, 2025 · US
Scalable system on a chip
US-12399830-B2 · Aug 26, 2025 · US
Mechanisms to utilize communication fabric via multi-port architecture
US-12277074-B1 · Apr 15, 2025 · US
Communication Fabric Structures for Increased Bandwidth
US-2025097166-A1 · Mar 20, 2025 · US
Recent patents
Latest publications not already listed above.
Gateway Circuit for Routing Multiple Types of Non-System-Memory Transactions
US-2025097167-A1 · Mar 20, 2025 · US
Centralized Non-System-Memory Gateway Circuit
US-2025094330-A1 · Mar 20, 2025 · US
Scalable System on a Chip
US-2024411695-A1 · Dec 12, 2024 · US
Complementary Die-to-Die Interface
US-2024403532-A1 · Dec 5, 2024 · US
Scalable System on a Chip
US-2024370371-A1 · Nov 7, 2024 · US
Complementary die-to-die interface
US-12112113-B2 · Oct 8, 2024 · US
Data encoding and packet sharing in a parallel communication interface
US-12047302-B2 · Jul 23, 2024 · US
Scalable system on a chip
US-12007895-B2 · Jun 11, 2024 · US
Scalable system on a chip
US-11934313-B2 · Mar 19, 2024 · US
Data Encoding and Packet Sharing in a Parallel Communication Interface
US-2023388241-A1 · Nov 30, 2023 · US
Multiple Independent On-chip Interconnect
US-2023350828-A1 · Nov 2, 2023 · US
Scalable system on a chip
US-11803471-B2 · Oct 31, 2023 · US
Segment to Segment Network Interface
US-2023239252-A1 · Jul 27, 2023 · US
Data encoding and packet sharing in a parallel communication interface
US-11706150-B2 · Jul 18, 2023 · US
Multiple independent on-chip interconnect
US-11675722-B2 · Jun 13, 2023 · US
Programmed input/output message control circuit
US-11609878-B2 · Mar 21, 2023 · US
Scalable System on a Chip
US-2023058989-A1 · Feb 23, 2023 · US
Scalable System on a Chip
US-2023053530-A1 · Feb 23, 2023 · US
Scalable System on a Chip
US-2023056044-A1 · Feb 23, 2023 · US
Programmed Input/Output Message Control Circuit
US-2022365900-A1 · Nov 17, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Apple Inc | 33 |
| Qualcomm Inc | 5 |
| Qualcomm Innovation Ct Inc | 3 |
| Qulacomm Incorporated | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| Y02D10/00 | 24 |
| G06F15/7807 | 16 |
| G06F13/1668 | 15 |
| G06F13/28 | 13 |
| G06F13/4068 | 13 |