Stacked semiconductor package having mold vias and method for manufacturing the same
US-11257801-B2 · Feb 22, 2022 · US
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Ko Eun patents
Ko Eun is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ko Eun |
| Total patents | 18 |
| First publication | Mar 12, 2015 |
| Latest publication | Feb 22, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
c-Met targeting compound-bioactive material conjugate and use thereof
US-10792371-B2 · Oct 6, 2020 · US
Stacked semiconductor package having mold vias and method for manufacturing the same
US-2019355707-A1 · Nov 21, 2019 · US
Stacked semiconductor package having mold vias and method for manufacturing the same
US-10418353-B2 · Sep 17, 2019 · US
Stacked semiconductor package having mold vias and method for manufacturing the same
US-2018331087-A1 · Nov 15, 2018 · US
C-met targeting compound-bioactive material conjugate and use thereof
US-2018236097-A1 · Aug 23, 2018 · US
Semiconductor chip flexibly applied to various routing structures and semiconductor chip module using the same
US-10002850-B2 · Jun 19, 2018 · US
Semiconductor package embedded with a plurality of chips
US-9966359-B2 · May 8, 2018 · US
C-Met targeting compound-bioactive material conjugate and use thereof
US-9889206-B2 · Feb 13, 2018 · US
Semiconductor chip and stacked semiconductor chip using the same
US-2017317056-A1 · Nov 2, 2017 · US
Recent patents
Latest publications not already listed above.
Stacked semiconductor package including reconfigurable package units
US-9780071-B2 · Oct 3, 2017 · US
Semiconductor package embedded with plurality of chips and method of manufacturing the same
US-9711482-B2 · Jul 18, 2017 · US
Memory device and electronic apparatus including the same
US-9607667-B1 · Mar 28, 2017 · US
Semiconductor package embedded with a plurality of chips
US-2017084575-A1 · Mar 23, 2017 · US
Memory device and electronic apparatus including the same
US-2017076762-A1 · Mar 16, 2017 · US
Semiconductor package embedded with plurality of chips and method of manufacturing the same
US-2017062384-A1 · Mar 2, 2017 · US
Semiconductor package having a plurality of semiconductor chips stacked therein
US-2017018527-A1 · Jan 19, 2017 · US
C-met targeting compound-bioactive material conjugate and use thereof
US-2015071950-A1 · Mar 12, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sk Hynix Inc | 14 |
| Samsung Electronics Co Ltd | 4 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 12 |
| H10W70/60 | 10 |
| H10W90/701 | 10 |
| H01L25/0652 | 9 |
| H10W90/722 | 8 |