Method of manufacturing substrate layered body and layered body
US-12261143-B2 · Mar 25, 2025 · US
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Kamada Jun patents
Kamada Jun is listed as an inventor on 40 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kamada Jun |
| Total patents | 40 |
| First publication | Jul 2, 2015 |
| Latest publication | Mar 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Substrate laminated body and method of manufacturing substrate laminated body
US-11859110-B2 · Jan 2, 2024 · US
Composition, multilayer body and method for producing multilayer body
US-2023275057-A1 · Aug 31, 2023 · US
Method for producing semiconductor device and intermediate for semiconductor device
US-11581197-B2 · Feb 14, 2023 · US
Secure processor and a program for a secure processor
US-11550962-B2 · Jan 10, 2023 · US
Method of producing electronic device
US-11462482-B2 · Oct 4, 2022 · US
Curable composition, coating material, solar cell coating material, solar cell back sheet coating material, adhesive, solar cell adhesive, solar cell back sheet adhesive, producing method of sheet, and curing agent
US-11421135-B2 · Aug 23, 2022 · US
Method of producing electronic device
US-11398389-B2 · Jul 26, 2022 · US
Adhesive member and production method for adhesive member
US-11332643-B2 · May 17, 2022 · US
Method of manufacturing substrate layered body and layered body
US-2021391292-A1 · Dec 16, 2021 · US
Recent patents
Latest publications not already listed above.
Blocked isocyanate, coating composition, adhesive composition, and article
US-11072678-B2 · Jul 27, 2021 · US
External wound-healing agent, and external wound-healing material
US-11058660-B2 · Jul 13, 2021 · US
Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same
US-10988647-B2 · Apr 27, 2021 · US
Semiconductor substrate manufacturing method, semiconductor device, and method for manufacturing same
US-2020377772-A1 · Dec 3, 2020 · US
Secure processor and a program for a secure processor
US-2020265169-A1 · Aug 20, 2020 · US
Method of producing electronic device
US-2020219823-A1 · Jul 9, 2020 · US
Method of producing electronic device
US-2020219734-A1 · Jul 9, 2020 · US
Secure processor and a program for a secure processor
US-10685145-B2 · Jun 16, 2020 · US
Adhesive member and production method for adhesive member
US-2020181457-A1 · Jun 11, 2020 · US
Method for producing semiconductor device and intermediate for semiconductor device
US-2020168476-A1 · May 28, 2020 · US
Substrate laminated body and method of manufacturing substrate laminated body
US-2020048515-A1 · Feb 13, 2020 · US
Blocked isocyanate, coating composition, adhesive composition, and article
US-2019315910-A1 · Oct 17, 2019 · US
Blocked isocyanate, coating composition, adhesive composition, and article
US-10385157-B2 · Aug 20, 2019 · US
Secure processor and a program for a secure processor
US-2019236314-A1 · Aug 1, 2019 · US
Curable composition, coating material, solar cell coating material, solar cell back sheet coating material, adhesive, solar cell adhesive, solar cell back sheet adhesive, producing method of sheet, and curing agent
US-2019211241-A1 · Jul 11, 2019 · US
Semiconductor wafer surface protection film and method for manufacturing semiconductor device
US-10340172-B2 · Jul 2, 2019 · US
Secure processor and a program for a secure processor
US-10303901-B2 · May 28, 2019 · US
External wound-healing agent, and external wound-healing material
US-2019133987-A1 · May 9, 2019 · US
Secure processor and a program for a secure processor
US-10095890-B2 · Oct 9, 2018 · US
Semiconductor wafer surface protection film and method for manufacturing semiconductor device
US-2018197764-A1 · Jul 12, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsui Chemicals Inc | 20 |
| Socionext Inc | 12 |
| Mitsui Chemicals Tohcello Inc | 7 |
| Fujitsu Semiconductor Ltd | 1 |
| Mitsui Chemicals Tehcello Inc | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G06F21/71 | 13 |
| G06F21/52 | 12 |
| G06F21/554 | 12 |
| G06F21/72 | 12 |
| G06F21/70 | 12 |