Substrate laminated body and method of manufacturing substrate laminated body

Patent metadata

Field	Value
Publication number	US-11859110-B2
Application number	US-201816607898-A
Country	US
Kind code	B2
Filing date	Apr 24, 2018
Priority date	Apr 28, 2017
Publication date	Jan 2, 2024
Grant date	Jan 2, 2024

Abstract

A body, comprising stacked substrates, wherein: a first substrate, an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom and which has a defined weight average molecular weight, and a crosslinking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X is a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and a second substrate, are layered in this order, and the compound (A) comprises at least one selected from the group consisting of a defined aliphatic amine and a defined compound having a siloxane bond and an amino group.

First claim

The invention claimed is:

1. A body, comprising stacked substrates, wherein:
a first substrate,
an adhesion layer comprising a reaction product of a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom, and a cross-linking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups, which has a weight average molecular weight of from 200 to 600, X being a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms, and in which at least one X in the three or more —C(═O)OX groups is an alkyl group having from 1 to 6 carbon atoms, and
a second substrate,
are layered in this order, and
the compound (A) comprises a siloxane polymer having a siloxane bond (Si—O bond) and an amino group and having a weight average molecular weight of from 130 to 10,000.

2. The body, comprising stacked substrates, according to claim 1 , wherein the adhesion layer has a thickness of from 0.1 nm to 5,000 nm.

3. The body, comprising stacked substrates, according to claim 1 , having a tensile bonding strength of 5 MPa or more.

4. The body, comprising stacked substrates, according to claim 1 , wherein the cross-linking agent (B) has a ring structure in the molecule.

5. The body, comprising stacked substrates, according to claim 4 , wherein the ring structure in the cross-linking agent (B) is a ring structure having two or more —C(═O)OX groups.

6. The body, comprising stacked substrates, according to claim 4 , wherein the ring structure is at least one of a benzene ring or a naphthalene ring.

7. The body, comprising stacked substrates, according to claim 1 wherein the siloxane polymer having a siloxane bond (Si—O bond) and an amino group and having a weight average molecular weight of from 130 to 10,000 satisfies a relationship of (non-cross-linkable group)/Si<2 as a molar ratio of a non-cross-linkable group bound to an Si element, to the Si element.

8. The body, comprising stacked substrates, according to claim 1 , wherein the reaction product has at least one of an amide bond or an imide bond.

9. The body, comprising stacked substrates, according to claim 1 , wherein a temperature at which a pressure of outgas under a reduced pressure reaches 2×10 −6 Pa is 400° C. or more.

10. The body, comprising stacked substrates, according to claim 1 , wherein at least one of the first substrate or the second substrate is provided with an electrode at a surface thereof, the surface being closer to the adhesion layer.

11. The body, comprising stacked substrates, according to claim 1 , wherein at least one of the first substrate or the second substrate comprises at least one element selected from the group consisting of Si, Al, Ti, Zr, Hf, Fe, Ni, Cu, Ag, Au, Ga, Ge, Sn, Pd, As, Pt, Mg, In, Ta and Nb.

12. The body, comprising stacked substrates, according to claim 11 , wherein at least one of the first substrate or the second substrate is a semiconductor substrate comprising at least one element selected from the group consisting of Si, Ga, Ge and As.

13. A method of manufacturing a body comprising stacked substrates, the method comprising:
a first step of forming, on a first substrate, a film comprising a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom;
a second step of providing, on the film, a cross-linking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X being a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms;
a third step of layering a second substrate on a surface on which a film comprising the compound (A) and the cross-linking agent (B) is formed; and
a heating step of heating the film comprising the compound (A) and the cross-linking agent (B) to a temperature of from 70° C. to 450° C., thereby forming an adhesion layer comprising a reaction product of the compound (A) and the cross-linking agent (B),
wherein the compound (A) comprises a compound having a siloxane bond (Si—O bond) and an amino group and having a weight average molecular weight of from 130 to 10,000.

14. A method of manufacturing a body comprising stacked substrates, the method comprising:
a fifth step of forming, on a first substrate, a film comprising a compound (A), which has a cationic functional group containing at least one of a primary nitrogen atom or a secondary nitrogen atom, and a cross-linking agent (B), which has three or more —C(═O)OX groups in a molecule, in which from one to six of the three or more —C(═O)OX groups are —C(═O)OH groups and which has a weight average molecular weight of from 200 to 600, X being a hydrogen atom or an alkyl group having from 1 to 6 carbon atoms;
a sixth step of layering a second substrate on a surface at which the film including the compound (A) and the cross-linking agent (B) is formed; and
a heating step of heating the film comprising the compound (A) and the cross-linking agent (B) to a temperature of from 70° C. to 450° C., thereby forming an adhesion layer comprising a reaction product of the compound (A) and the cross-linking agent (B),
wherein the compound (A) comprises a compound having a siloxane bond (Si—O bond) and an amino group and having a weight average molecular weight of from 130 to 10,000.

15. The method of manufacturing a body comprising stacked substrates according to claim 13 , wherein a surface of the first substrate or the second substrate, on which the film comprising the compound (A) and the cross-linking agent (B) is to be formed, has at least one selected from the group consisting of a hydroxyl group, an epoxy group, a carboxy group, an amino group and a mercapto group.

16. The method of manufacturing a body comprising stacked substrates according to claim 15 , wherein:
at least one of the first substrate or the second substrate comprises at least one element selected from the group consisting of Si, Al, Ti, Zr, Hf, Fe, Ni, Cu, Ag, Au, Ga, Ge, Sn, Pd, As, Pt, Mg, In, Ta and Nb, and
the at least one selected from the group consisting of a hydroxyl group, an epoxy group, a carboxy group, an amino group and a mercapto group, is bound to the at least one element.

17. The method of manufacturing a body comprising stacked substrates according to claim 16 , wherein the surface of the first substrate or the second substrate, on which the film including the compound (A) and the cross-linking agent (B) is to be formed, has a silanol group (Si—OH group).

Assignees

• Mitsui Chemicals Inc

Inventors

• Kamada Jun
• Kohmura Kazuo
• Kayaba Yasuhisa

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/952

  comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/07338

  hardening the adhesive by curing, e.g. thermosetting · CPC title

• H10W72/07337

  using a polymer adhesive, e.g. an adhesive based on silicone or epoxy · CPC title