Fan-out semiconductor package including stacked chips
US-10734324-B2 · Aug 4, 2020 · US
This page is not indexed by search engines while we improve data quality.
Jo Eun Jung patents
Jo Eun Jung is listed as an inventor on 32 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Jo Eun Jung |
| Total patents | 32 |
| First publication | Apr 2, 2015 |
| Latest publication | Aug 4, 2020 |
Notable patents
Publications ranked by popularity score, then publication date.
Manufacturing method of an electronic component module
US-10667419-B2 · May 26, 2020 · US
Fan-out semiconductor package
US-10580759-B2 · Mar 3, 2020 · US
Semiconductor package
US-10483197-B2 · Nov 19, 2019 · US
Fan-out semiconductor package
US-2019326223-A1 · Oct 24, 2019 · US
Fan-out semiconductor package
US-2019267351-A1 · Aug 29, 2019 · US
Fan-out semiconductor package and package on package including the same
US-2019189600-A1 · Jun 20, 2019 · US
Semiconductor package
US-2019189549-A1 · Jun 20, 2019 · US
Fan-out semiconductor package and package on package including the same
US-10325891-B1 · Jun 18, 2019 · US
Semiconductor package
US-2019164893-A1 · May 30, 2019 · US
Recent patents
Latest publications not already listed above.
Fan-out semiconductor package
US-10304807-B2 · May 28, 2019 · US
Fan-out semiconductor package
US-10157886-B2 · Dec 18, 2018 · US
Fan-out semiconductor package
US-10096552-B2 · Oct 9, 2018 · US
Fan-out semiconductor package
US-2018233489-A1 · Aug 16, 2018 · US
Fan-out semiconductor package
US-2018190591-A1 · Jul 5, 2018 · US
Electronic component module and manufacturing method thereof
US-2018110147-A1 · Apr 19, 2018 · US
Fan-out semiconductor package
US-2018076178-A1 · Mar 15, 2018 · US
Electronic component module and manufacturing method thereof
US-9894790-B2 · Feb 13, 2018 · US
Electronic component module and manufacturing method thereof
US-9585260-B2 · Feb 28, 2017 · US
Semiconductor package and method of manufacturing the same
US-9508565-B2 · Nov 29, 2016 · US
Contact pin and power module package having the same
US-9318828-B2 · Apr 19, 2016 · US
Semiconductor package and method of manufacturing the same
US-2016020171-A1 · Jan 21, 2016 · US
Semiconductor package and method of manufacturing the same
US-2015228625-A1 · Aug 13, 2015 · US
External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the same
US-9105616-B2 · Aug 11, 2015 · US
Electronic component module and manufacturing method thereof
US-2015223361-A1 · Aug 6, 2015 · US
Semiconductor package module
US-2015181708-A1 · Jun 25, 2015 · US
Nested module package, and method for manufacturing same
US-2015163913-A1 · Jun 11, 2015 · US
Micro electro mechanical systems sensor module package and method of manufacturing the same
US-2015153378-A1 · Jun 4, 2015 · US
Electronic component module and manufacturing method thereof
US-2015131235-A1 · May 14, 2015 · US
Electronic component module and manufacturing method thereof
US-2015131231-A1 · May 14, 2015 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 31 |
| Samsung Electronics Co Ltd | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 25 |
| H10W90/724 | 19 |
| H10W90/701 | 19 |
| H10W70/685 | 15 |
| H10W70/65 | 15 |