Manufacturing method of an electronic component module

Patent metadata

Field	Value
Publication number	US-10667419-B2
Application number	US-201715825606-A
Country	US
Kind code	B2
Filing date	Nov 29, 2017
Priority date	Nov 8, 2013
Publication date	May 26, 2020
Grant date	May 26, 2020

Abstract

There are provided an electronic component module in which an external terminal is disposed outwardly from a mold part by a plating process and a manufacturing method thereof. The electronic component module includes a substrate, at least one electronic component mounted on the substrate, a mold part sealing the electronic component, and at least one connection conductor having one end bonded to one surface of the substrate and formed in the mold part so as to penetrate through the mold part. The connection conductor is formed to have a form in which horizontal cross-sectional areas of the connection conductor are gradually reduced toward the substrate and includes at least one step.

First claim

What is claimed is:

1. A manufacturing method of an electronic component module, the method comprising:
preparing a substrate;
mounting at least one electronic component on the substrate;
forming a mold part sealing the electronic component;
forming a via hole in the mold part; and
forming a connection conductor in the via hole by a plating process,
wherein the forming of the via hole includes increasing a degree of roughness of an inner surface of the via hole using the laser beam,
wherein each of the via holes comprises a side wall and a horizontal extension surface horizontally increasing a cross-sectional area of the via holes, and
a degree of roughness of the horizontal extension surface is greater than a degree of roughness of the side wall.

2. The method of claim 1 , wherein in the mounting of the electronic component, a plurality of electronic components are mounted on both surfaces of the substrate.

3. The method of claim 1 , wherein in the forming of the mold part, the mold part is formed on both surfaces of the substrate.

4. The method of claim 1 , wherein in the forming of the via hole, the via hole is formed using a laser drilling process.

5. The method of claim 1 , wherein the horizontal extension surface is continuously formed to have a spiral form.

6. The method of claim 1 , wherein the forming of the connection conductor further includes disposing a catalytic metal on a surface of the via hole having an increased degree of roughness.

7. The method of claim 1 , wherein in the forming of the connection conductor, the connection conductor is bonded to an inner surface of the via hole by a mechanical interlocking mechanism.

8. The method of claim 1 , wherein in the forming of the mold part, the mold part is formed using an epoxy molding compound (EMC) and in the forming of the connection conductor, the connection conductor is formed through a copper plating process.

9. The method of claim 1 , further comprising forming an external connection terminal on the connection conductor.

10. The method of claim 1 , wherein in the preparing of the substrate, the substrate having an electroplating wiring formed on at least one surface of the surface is prepared, and in the forming of the connection conductor, the connection conductor is formed through electroplating.

11. A manufacturing method of an electronic component module, the method comprising:
preparing a substrate having at least one component sealed by a mold part;
forming a via hole in the mold part and forming a side wall and a horizontal extension surface to have a form in which a cross-sectional area of the via hole is horizontally increased; and
forming a connection conductor in the via hole by a plating process,
wherein the forming of the via hole includes increasing a degree of roughness of an inner surface of the via hole using the laser beam, and
a degree of roughness of the horizontal extension surface is greater than a degree of roughness of the side wall.

12. The method of claim 11 , wherein in the forming of the via hole, the via hole is formed to have a Roughness Average (Ra) of an inner surface of 5 μm or more.

13. The method of claim 11 , wherein in the forming of the via hole, one surface of the substrate and a side wall of the via hole form an angle of 25° to 90°.

14. The method of claim 11 , wherein the forming of the connection conductor includes forming an end of the connection conductor to be convex or concave.

15. The method of claim 14 , further comprising forming the end of the connection conductor to be flat by grinding the end of the connection conductor.

Assignees

• Samsung Electro Mech

Inventors

• Yoo Do Jae
• Jo Eun Jung
• Lim Jae Hyun

Classifications

• H05K5/065 Primary

  sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding · CPC title

• H05K1/115

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K2203/107

  Using laser light · CPC title

• H05K3/0047

  Drilling of holes · CPC title

• H05K2201/09827

  Tapered, e.g. tapered hole, via or groove · CPC title