Semiconductor layout in finfet technologies
US-2026023912-A1 · Jan 22, 2026 · US
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Hoffmann Thomas patents
Hoffmann Thomas is listed as an inventor on 74 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hoffmann Thomas |
| Total patents | 74 |
| First publication | Apr 28, 2015 |
| Latest publication | Jan 22, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor layout in FinFET technologies
US-12450418-B2 · Oct 21, 2025 · US
Method and apparatus for monitoring a configuration status of a remote sensor device
US-12301412-B2 · May 13, 2025 · US
Leakage current reduction in electrical isolation gate structures
US-12278232-B2 · Apr 15, 2025 · US
Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology
US-2025029921-A1 · Jan 23, 2025 · US
Method and apparatus for enabling a virtual building management system
US-12207341-B2 · Jan 21, 2025 · US
Selectable monolithic or external scalable die-to-die interconnection system methodology
US-12087689-B2 · Sep 10, 2024 · US
Method and apparatus for control action adjustments using universal time coordinated (UTC) time
US-12069600-B2 · Aug 20, 2024 · US
Vertical Transistor Cell Structures Utilizing Topside and Backside Resources
US-2024105727-A1 · Mar 28, 2024 · US
Vertical Transistors With Backside Power Delivery
US-2024105617-A1 · Mar 28, 2024 · US
Recent patents
Latest publications not already listed above.
System, Method and Apparatus for Building Operations Management
US-2024089719-A1 · Mar 14, 2024 · US
Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology
US-2024047353-A1 · Feb 8, 2024 · US
System, Method and Apparatus for Configuring a Node in a Sensor Network
US-2024007348-A1 · Jan 4, 2024 · US
Selectable monolithic or external scalable die-to-die interconnection system methodology
US-11862557-B2 · Jan 2, 2024 · US
Semiconductor layout in finfet technologies
US-2023409797-A1 · Dec 21, 2023 · US
System, method and apparatus for virtual building management
US-11825547-B2 · Nov 21, 2023 · US
System, Method and Apparatus for Configuring a Node in a Sensor Network
US-2023269134-A9 · Aug 24, 2023 · US
System, Method and Apparatus for Building Operations Management
US-2023262443-A1 · Aug 17, 2023 · US
System, method and apparatus for configuring a node in a sensor network
US-11722365-B2 · Aug 8, 2023 · US
Semiconductor layout in FinFET technologies
US-11720734-B2 · Aug 8, 2023 · US
System, Method and Apparatus for Sensor Control Applications
US-2023232352-A1 · Jul 20, 2023 · US
Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology
US-2023085890-A1 · Mar 23, 2023 · US
System, method and apparatus for sensor control applications
US-11595926-B2 · Feb 28, 2023 · US
Leakage Current Reduction in Electrical Isolation Gate Structures
US-2023005908-A1 · Jan 5, 2023 · US
System, method and apparatus for building operations management
US-11470462-B2 · Oct 11, 2022 · US
Leakage current reduction in electrical isolation gate structures
US-11469226-B2 · Oct 11, 2022 · US
System, Method and Apparatus for Building Operations Management
US-2021144540-A1 · May 13, 2021 · US
System, Method and Apparatus for Integrated Building Operations Management
US-2021126814-A1 · Apr 29, 2021 · US
Automatic browser inactivity detection method and apparatus
US-10965768-B2 · Mar 30, 2021 · US
Semiconductor layout in finfet technologies
US-2020401752-A1 · Dec 24, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mie Fujitsu Semiconductor Ltd | 24 |
| Senseware Inc | 22 |
| Apple Inc | 20 |
| Oath Inc | 3 |
| Hoffmann Thomas | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 28 |
| H10D30/601 | 18 |
| H10D62/371 | 17 |
| H04L67/12 | 17 |
| H10D62/314 | 16 |