Method of manufacturing a hybrid device
US-12300759-B2 · May 13, 2025 · US
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Hellmund Oliver patents
Hellmund Oliver is listed as an inventor on 43 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Hellmund Oliver |
| Total patents | 43 |
| First publication | Feb 2, 2017 |
| Latest publication | May 13, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor device having semiconductor device elements in a semiconductor layer
US-12107130-B2 · Oct 1, 2024 · US
Semiconductor device including an electrical contact with a metal layer arranged thereon
US-11552048-B2 · Jan 10, 2023 · US
Method of manufacturing a hybrid device
US-2022238751-A1 · Jul 28, 2022 · US
Semiconductor device having semiconductor device elements in a semiconductor layer
US-2021265468-A1 · Aug 26, 2021 · US
Molding compound and semiconductor package with a molding compound
US-11069626-B2 · Jul 20, 2021 · US
Semiconductor device and manufacturing method
US-11038028-B2 · Jun 15, 2021 · US
Semiconductor device including an electrical contact with a metal layer arranged thereon
US-2021167036-A1 · Jun 3, 2021 · US
Devices with backside metal structures and methods of formation thereof
US-11011409-B2 · May 18, 2021 · US
Switch device
US-10707865-B2 · Jul 7, 2020 · US
Recent patents
Latest publications not already listed above.
Devices with Backside Metal Structures and Methods of Formation Thereof
US-2020098617-A1 · Mar 26, 2020 · US
Forming silicon oxide layers by radical oxidation and semiconductor device with silicon oxide layer
US-10566426-B2 · Feb 18, 2020 · US
Isolation of semiconductor device with buried cavity
US-10553675-B2 · Feb 4, 2020 · US
Devices with backside metal structures and methods of formation thereof
US-10535553-B2 · Jan 14, 2020 · US
Semiconductor Device and Manufacturing Method
US-2019348506-A1 · Nov 14, 2019 · US
Molding Compound and Semiconductor Package with a Molding Compound
US-2019318996-A1 · Oct 17, 2019 · US
Method of processing a porous conductive structure in connection to an electronic component on a substrate
US-10373868-B2 · Aug 6, 2019 · US
Method of wafer thinning and realizing backside metal structures
US-10325804-B2 · Jun 18, 2019 · US
Switch Device
US-2019074831-A1 · Mar 7, 2019 · US
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
US-10199372-B2 · Feb 5, 2019 · US
Method of manufacturing a semiconductor device comprising a support element and semiconductor device comprising a support element
US-10199332-B2 · Feb 5, 2019 · US
Methods for forming a semiconductor device and semiconductor devices
US-10177033-B2 · Jan 8, 2019 · US
Monolithically integrated chip including active electrical components and passive electrical components with chip edge stabilization structures
US-2018374843-A1 · Dec 27, 2018 · US
Switch device
US-10158356-B2 · Dec 18, 2018 · US
Method of manufacturing semiconductor devices with transistor cells and semiconductor device
US-10121859-B2 · Nov 6, 2018 · US
Semiconductor device and methods for forming a plurality of semiconductor devices
US-10074566-B2 · Sep 11, 2018 · US
Devices with Backside Metal Structures and Methods of Formation Thereof
US-2018233399-A1 · Aug 16, 2018 · US
Forming silicon oxide layers by radical oxidation and semiconductor device with silicon oxide layer
US-2018175150-A1 · Jun 21, 2018 · US
Method of Wafer Thinning and Realizing Backside Metal Structures
US-2018144974-A1 · May 24, 2018 · US
Semiconductor devices and methods for manufacturing semiconductor devices
US-2018144982-A1 · May 24, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 37 |
| Infineon Technologies Austria Ag | 6 |
| Univ Graz Tech | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D12/441 | 12 |
| H10W10/181 | 12 |
| H10W10/061 | 12 |
| H10W10/17 | 12 |
| H10W10/014 | 12 |