Semiconductor package, power electronic system and method for coupling a semiconductor package to a heatsink
US-2026047451-A1 · Feb 12, 2026 · US
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Grassmann Andreas patents
Grassmann Andreas is listed as an inventor on 77 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Grassmann Andreas |
| Total patents | 77 |
| First publication | Mar 26, 2015 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Power semiconductor package having a pcb and method for fabricating a power semiconductor package
US-2026047481-A1 · Feb 12, 2026 · US
Molded Electronic Component Having a Metallic Loops Embedded in a Mold Compound
US-2025293194-A1 · Sep 18, 2025 · US
Power semiconductor assembly having an embedded power semiconductor die and method for fabricating the same
US-2025266312-A1 · Aug 21, 2025 · US
Method and device for producing a housing
US-12261063-B2 · Mar 25, 2025 · US
Power semiconductor package
US-2025062290-A1 · Feb 20, 2025 · US
Power module having a lead frame that provides substrate support and forms terminals of the power module
US-2025054840-A1 · Feb 13, 2025 · US
Leadframe, Encapsulated Package with Punched Lead and Sawn Side Flanks, and Corresponding Manufacturing Method
US-2025054843-A1 · Feb 13, 2025 · US
Power semiconductor package having first and second lead frames
US-12211824-B2 · Jan 28, 2025 · US
Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method
US-12165959-B2 · Dec 10, 2024 · US
Recent patents
Latest publications not already listed above.
Power electronic system including a semiconductor module and a cooler and method for fabricating the same
US-2024387325-A1 · Nov 21, 2024 · US
Power Module with Semiconductor Packages Mounted on Metal Frame
US-2024258216-A1 · Aug 1, 2024 · US
Substrate arrangement and methods for producing a substrate arrangement
US-2024162129-A1 · May 16, 2024 · US
Power semiconductor package and method for fabricating the same
US-2024162205-A1 · May 16, 2024 · US
Power module with semiconductor packages mounted on metal frame
US-11973012-B2 · Apr 30, 2024 · US
Package with encapsulated electronic component between laminate and thermally conductive carrier
US-11908760-B2 · Feb 20, 2024 · US
Fluid-cooled package having shielding layer
US-11862533-B2 · Jan 2, 2024 · US
Molded power semiconductor package
US-2023361087-A1 · Nov 9, 2023 · US
Power semiconductor package having first and second lead frames
US-2023361088-A1 · Nov 9, 2023 · US
Semiconductor package and method for fabricating the same
US-2023352378-A1 · Nov 2, 2023 · US
Semiconductor package with barrier to contain thermal interface material
US-11626351-B2 · Apr 11, 2023 · US
Power semiconductor module and method for producing a power semiconductor module
US-11598904-B2 · Mar 7, 2023 · US
Power module comprising two substrates and method of manufacturing the same
US-11574889-B2 · Feb 7, 2023 · US
Semiconductor Device Module Comprising Flexible Leads for the Purpose of Height Adjustment
US-2023035550-A1 · Feb 2, 2023 · US
Power Module with Semiconductor Packages Mounted on Metal Frame
US-2023025736-A1 · Jan 26, 2023 · US
Method and Device for Producing a Housing
US-2022285178-A1 · Sep 8, 2022 · US
Semiconductor Package with Barrier to Contain Thermal Interface Material
US-2022238422-A1 · Jul 28, 2022 · US
Double sided cooling module with power transistor submodules
US-2022238413-A1 · Jul 28, 2022 · US
Package with encapsulated electronic component between laminate and thermally conductive carrier
US-2022230930-A1 · Jul 21, 2022 · US
Fluid-Cooled Package Having Shielding Layer
US-2022115293-A1 · Apr 14, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Infineon Technologies Ag | 69 |
| Infineon Technologies Austria Ag | 7 |
| Hyundai Motor Co Ltd | 4 |
| Kia Motors Corp | 4 |
| Infineon Technologies Austria | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W74/00 | 36 |
| H10W90/00 | 36 |
| H10W74/111 | 36 |
| H10W74/114 | 35 |
| H10W40/255 | 34 |