Method and device for producing a housing

Patent metadata

Field	Value
Publication number	US-12261063-B2
Application number	US-202217685870-A
Country	US
Kind code	B2
Filing date	Mar 3, 2022
Priority date	Mar 5, 2021
Publication date	Mar 25, 2025
Grant date	Mar 25, 2025

Abstract

A device for forming a housing for a power semiconductor module arrangement includes a mold. The mold includes a first cavity including a plurality of first openings and a second opening, the second opening being coupled to a runner system, wherein the runner system is configured to inject a mold material into the first cavity through the second opening. The device further includes a plurality of sleeves or hollow bushings, wherein a first end of each of the plurality of sleeves or hollow bushings is arranged in one of the first openings, and wherein a second end of each of the plurality of sleeves or hollow bushings extends to the outside of the mold, a heating element configured to heat the mold, and a cooling element configured to cool the plurality of sleeves or hollow bushings.

First claim

The invention claimed is:

1. A device for forming a housing for a power semiconductor module arrangement comprises a mold, wherein the mold comprises:
a first cavity comprising a plurality of first openings and a second opening, the second opening being coupled to a runner system, wherein the runner system is configured to inject a mold material into the first cavity through the second opening;
a plurality of sleeves or hollow bushings, wherein a first end of each of the plurality of sleeves or hollow bushings is arranged in one of the first openings, and wherein a second end of each of the plurality of sleeves or hollow bushings extends to the outside of the mold;
a heating element configured to heat the mold; and
a cooling element configured to cool the plurality of sleeves or hollow bushings.

2. The device of claim 1 , wherein the cooling element is coupled to the second end of each of the plurality of sleeves or hollow bushings.

3. The device of claim 1 , wherein each of the plurality of sleeves or hollow bushings comprises a heat conducting material.

4. The device of claim 3 , wherein each of the plurality of sleeves or hollow bushings comprises a metal.

5. The device of claim 1 , wherein the first cavity comprises the form of the housing that is to be formed.

6. The device of claim 1 , further comprising a downholder, wherein the downholder is configured to, when a semiconductor module arrangement is arranged in the first cavity and one of a plurality of terminal elements is arranged in a different one of the plurality of sleeves or hollow bushings, press the plurality of terminal elements on the power semiconductor module arrangement.

7. The device of claim 6 , wherein the downholder comprises a plurality of springs arranged between a first plate and one of a plurality of second plates, wherein each of the plurality of second plates is configured to contact one of the plurality of terminal elements.

8. The device of claim 1 , wherein the heating element is configured to heat the mold to a temperature of between 150° C. and 200° C., and wherein the cooling element is configured to cool the plurality of sleeves or hollow bushings to a temperature of between 0° C. and 50° C.

9. The device of claim 1 , wherein the cooling element is a water cooled cooling element.

10. The device of claim 1 , wherein the first ends of the plurality of sleeves or hollow bushings are funnel-shaped.

11. The device of claim 1 , further comprising a plurality of thermal isolations, wherein each thermal isolation is arranged between a different one of the plurality of sleeves or hollow bushings and the mold and is configured to thermally isolate the respective sleeve or hollow bushing from the mold.

12. The device of claim 11 , wherein each of the plurality of thermal isolations comprises a layer of a thermally isolating material or an air filled chamber.

13. A method comprising:
arranging a power semiconductor module arrangement in the first cavity of the device according to claim 1 ;
arranging one of a plurality of terminal elements in each of the plurality of sleeves or hollow bushings such that a first end of each of the terminal elements contacts the power semiconductor module arrangement, and a second end of each of the terminal elements protrudes through the respective sleeve or hollow bushing and out of the mold;
heating a mold material and pressing the mold material into the first cavity; and
cooling the plurality of sleeves or hollow bushings by means of the cooling element, wherein
the mold material hardens in the vicinity of the first ends of the plurality of sleeves or hollow bushings when it comes into contact with the respective first end, thereby sealing the second openings of the first cavity.

14. The method of claim 13 , further comprising, after completely filling the first cavity with the mold material, hardening the mold material.

15. The method of claim 13 , further comprising, while pressing the mold material into the first cavity, pressing the plurality of terminal elements on the power semiconductor module arrangement.

Assignees

• Infineon Technologies Ag

Inventors

• Grassmann Andreas

Classifications

• H10W72/551

  Materials of bond wires · CPC title

• H10W74/10

  characterised by their shape or disposition · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/00

  Package configurations · CPC title