Leadframe, encapsulated package with punched lead and sawn side flanks, and corresponding manufacturing method

Patent metadata

Field	Value
Publication number	US-12165959-B2
Application number	US-202117150739-A
Country	US
Kind code	B2
Filing date	Jan 15, 2021
Priority date	Jan 17, 2020
Publication date	Dec 10, 2024
Grant date	Dec 10, 2024

Abstract

A package includes a carrier, an electronic component on the carrier, an encapsulant encapsulating at least part of the carrier and the electronic component, and at least one lead extending beyond the encapsulant and having a punched surface, wherein at least part of at least one side flank of the encapsulant has a sawn texture.

First claim

The invention claimed is:

1. A method of manufacturing a package, the method comprising:
mounting an electronic component on a carrier;
encapsulating at least part of the carrier and the electronic component by an encapsulant;
punching at least one lead extending beyond the encapsulant; and
sawing at least part of at least one side flank of the encapsulant,
wherein the method comprises:
mounting further electronic components on further carriers, so that the further electronic components and the further carriers are arranged in a plurality of rows and columns;
encapsulating at least part of the further carriers and the further electronic components by further encapsulant;
punching further leads extending beyond the further encapsulant;
sawing further side flanks of the further encapsulant;
connecting a clipframe to at least part of the carriers, wherein the clipframe comprises a plurality of clips between two adjacent columns; and
separating the clipframe into the clips by punching a tie bar connecting adjacent clips.

2. The method according to claim 1 , wherein the method comprises connecting carriers of at least one column by at least one tie bar, and subsequently singularizing into the plurality of packages by sawing through the at least one tie bar.

3. The method according to any of claim 1 , wherein the method comprises carrying out the punching before the sawing.

4. The method according to claim 1 , wherein the method comprises carrying out the sawing along a sawing direction perpendicular to an extension direction of each of the columns.

5. The method according to claim 1 , wherein the method comprises testing the packages before the sawing, and in particular after the punching.

6. The method according to claim 1 , wherein the method comprises one of the following:
punching a plurality of leads by removing a continuous strip of material connecting the carriers; and
punching a plurality of leads by removing a plurality of non-continuous sections of material connecting the carriers.

7. The method according to claim 1 , wherein the method comprises arranging the leads in an interdigitate fashion.

8. The method according to claim 1 , further comprising:
providing at least one second lead extending away from an opposite side of the encapsulant as the at least one lead; and
punching the least one second lead.

Assignees

• Infineon Technologies Ag

Inventors

• Singer Frank
• Boehm Marcus
• Grassmann Andreas
• Gruber Martin
• Schindler Uwe

Classifications

• H10W90/811

  Multiple chips on leadframes · CPC title

• H10W74/111 Primary

  the semiconductor body being completely enclosed · CPC title

• H10W74/016

  using moulds · CPC title

• H10W70/466

  Tape carriers or flat leads · CPC title

• H10W70/465

  Bumps or wires · CPC title