Semiconductor package with gas release holes
US-12557694-B2 · Feb 17, 2026 · US
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Gani David patents
Gani David is listed as an inventor on 66 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Gani David |
| Total patents | 66 |
| First publication | Apr 16, 2015 |
| Latest publication | Feb 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Sensor die package
US-2025311457-A1 · Oct 2, 2025 · US
Sensor die package
US-12364038-B2 · Jul 15, 2025 · US
Slanted glass edge for image sensor package
US-12356743-B2 · Jul 8, 2025 · US
Multi-chip package
US-12136608-B2 · Nov 5, 2024 · US
Optical sensor package with light shielding material
US-2024332436-A1 · Oct 3, 2024 · US
Optical sensor package with light shielding material
US-2024332328-A1 · Oct 3, 2024 · US
Slanted glass edge for image sensor package
US-2024194709-A1 · Jun 13, 2024 · US
Wafer level proximity sensor
US-11996397-B2 · May 28, 2024 · US
Panel level semiconductor package and method of manufacturing the same
US-2024145258-A1 · May 2, 2024 · US
Recent patents
Latest publications not already listed above.
Slanted glass edge for image sensor package
US-11942496-B2 · Mar 26, 2024 · US
Method for manufacturing a wafer level chip scale package (WLCSP)
US-11908831-B2 · Feb 20, 2024 · US
Proximity sensor with integrated ALS
US-11828875-B2 · Nov 28, 2023 · US
Semiconductor package with gas release holes
US-2023307302-A1 · Sep 28, 2023 · US
WLCSP with transparent substrate and method of manufacturing the same
US-11742437-B2 · Aug 29, 2023 · US
Semiconductor package with exposed electrical contacts
US-2023230949-A1 · Jul 20, 2023 · US
Multi-chip package
US-2023197688-A1 · Jun 22, 2023 · US
Crack detection integrity check
US-11585847-B2 · Feb 21, 2023 · US
WLCSP package with different solder volumes
US-11581280-B2 · Feb 14, 2023 · US
Multi-chip package
US-11581289-B2 · Feb 14, 2023 · US
Semiconductor package with protected sidewall and method of forming the same
US-11562937-B2 · Jan 24, 2023 · US
Electronic device comprising a support substrate and stacked electronic chips
US-11527511-B2 · Dec 13, 2022 · US
Thin semiconductor chip using a dummy sidewall layer
US-11502029-B2 · Nov 15, 2022 · US
Crack detection integrity check
US-2022291277-A1 · Sep 15, 2022 · US
Package with lead frame with improved lead design for discrete electrical components and manufacturing the same
US-11404355-B2 · Aug 2, 2022 · US
Sensor die package
US-2022208819-A1 · Jun 30, 2022 · US
Crack detection integrity check
US-11366156-B2 · Jun 21, 2022 · US
Method for manufacturing a wafer level chip scale package (wlcsp)
US-2022122941-A1 · Apr 21, 2022 · US
Proximity sensor with integrated als
US-2022107392-A1 · Apr 7, 2022 · US
Package with electrical interconnection bridge
US-11270946-B2 · Mar 8, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| St Microelectronics Pte Ltd | 65 |
| St Microelectronics Ltd | 7 |
| St Microelectronics Inc | 4 |
| St Microelectronics Grenoble 2 | 3 |
| St Microelectronics Int Nv | 2 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 22 |
| H10W74/014 | 18 |
| H10W72/0198 | 16 |
| H10W72/29 | 14 |
| H10W74/117 | 13 |