Slanted glass edge for image sensor package

Patent metadata

Field	Value
Publication number	US-11942496-B2
Application number	US-202117326537-A
Country	US
Kind code	B2
Filing date	May 21, 2021
Priority date	Jun 4, 2020
Publication date	Mar 26, 2024
Grant date	Mar 26, 2024

Abstract

A digital image sensor package includes an image sensor substrate and a glass covering. The image sensor substrate carries photodiodes. The glass covering has a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering. The glass covering overlies the photodiodes. A surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to the top and bottom surfaces of the glass.

First claim

The invention claimed is:

1. A digital image sensor package, comprising:
an image sensor substrate carrying photodiodes; and
a glass covering having a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the glass covering, wherein the glass covering is monolithic and overlies all of the photodiodes;
wherein a surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering such that the sidewall is anti-perpendicular to one or both of the top and bottom surfaces of the glass; and
wherein a surface area of a top surface of the image sensor substrate is greater than the surface area of the bottom surface of the glass covering.

2. The digital image sensor package of claim 1 , wherein the sidewall and the top surface of the glass covering form an acute angle, and wherein the sidewall and the bottom surface of the glass covering form an obtuse angle.

3. The digital image sensor package of claim 1 , wherein an outer surface of the sidewall is flat.

4. The digital image sensor package of claim 1 , wherein a space between the sidewall and image sensor substrate is devoid of photoabsorbent materials.

5. The digital image sensor package of claim 1 , wherein at least a portion of the bottom surface of the glass covering is physically coupled to the image sensor substrate.

6. The digital image sensor package of claim 1 , further comprising a printed circuit board carrying the image sensor substrate.

7. The digital image sensor package of claim 6 , further comprising mounting hardware physically coupling portions of the bottom surface of the glass covering to the printed circuit board.

8. The digital image sensor package of claim 7 , wherein the mounting hardware comprises a first portion physically coupled to the printed circuit board and extending upwardly therefrom, a second portion extending inwardly from a periphery of the image sensor substrate toward the photodiodes, and an intermediate connecting portion connecting the first portion to the second portion, wherein portions of the bottom surface of the glass covering are physically coupled to the second portion of the mounting hardware.

9. A digital image sensor package, comprising:
a printed circuit board;
an image sensor substrate stacked on the printed circuit board and including photodiodes; and
a transparent covering associated with the image sensor substrate and having a bottom surface, a top surface opposite the bottom surface, and a sidewall delimiting a perimeter edge of the transparent covering, wherein the transparent covering is monolithic and overlies all of the photodiodes of the image sensor substrate, wherein a surface area of the top surface of the image sensor substrate is greater than a surface area of the bottom surface of the transparent covering;
wherein the sidewall and the top surface of the transparent covering form a first angle, and the sidewall and the bottom surface of the transparent covering form a second angle different than the first angle; and
wherein the first and second angles are such that light that enters the transparent covering on a first trajectory that results in the light impinging upon the sidewall being reflected on a second trajectory that avoids the image sensor substrate.

10. The digital image sensor package of claim 9 , wherein the first angle is an acute angle and the second angle is an obtuse angle.

11. The digital image sensor package of claim 9 , wherein at least a portion of the bottom surface of the transparent covering is physically coupled to the image sensor substrate.

12. The digital image sensor package of claim 9 , further comprising mounting hardware physically coupling portions of the bottom surface of the transparent covering to the printed circuit board.

13. The digital image sensor package of claim 12 , wherein the mounting hardware comprises a first portion physically coupled to the printed circuit board and extending upwardly therefrom, a second portion extending inwardly from a periphery of the image sensor substrate, and an intermediate connecting portion connecting the first portion to the second portion, wherein portions of the bottom surface of the transparent covering are physically coupled to the second portion of the mounting hardware.

14. The digital image sensor package of claim 9 , wherein an outer surface of the sidewall is flat.

15. The digital image sensor package of claim 9 , wherein a space between the sidewall and image sensor substrate is devoid of photoabsorbent materials.

16. A digital image sensor package, comprising:
an image sensor including photodiodes; and
a glass covering overlying all of the photodiodes of the image sensor and being trapezoidal in cross section, with a surface area of a top surface of the glass covering being greater than a surface area of a bottom surface of the glass covering, the bottom surface facing the image sensor and the top surface facing away from the image sensor;
wherein the glass covering is monolithic and a surface area of the top surface of the image sensor is greater than the surface area of the bottom surface of the glass covering.

17. The digital image sensor package of claim 16 , wherein the top surface of the glass covering being greater in surface area than the bottom surface of the glass covering results in a portion of free space being located between the top surface and the image sensor.

18. The digital image sensor package of claim 16 , wherein at least a portion of the bottom surface of the glass covering is physically coupled to the image sensor.

19. The digital image sensor package of claim 16 , further comprising:
a printed circuit board carrying the image sensor; and
mounting hardware physically coupling portions of the bottom surface of the glass covering to the printed circuit board;
wherein the mounting hardware comprises a first portion physically coupled to the printed circuit board and extending upwardly therefrom, a second portion extending inwardly from a periphery of the image sensor, and an intermediate connecting portion connecting the first portion to the second portion, wherein portions of the bottom surface of the glass covering are physically coupled to the second portion of the mounting hardware.

20. The digital image sensor package of claim 16 , wherein the trapezoidal cross section of the glass covering includes the top surface, the bottom surface, and a sidewall connecting the top surface to the bottom surface; and wherein the trapezoidal cross section of the glass covering results in light that enters the glass covering on a trajectory that results in the light impinging upon the sidewall being reflected away from the image sensor.

21. A digital image sensor package, comprising:
an image sensor substrate carrying photodiodes; and
a glass covering having a bottom surface, a top surface opposite the bottom surface, and a flat sidewall delimiting a perimeter edge of the glass covering, wherein the glass covering is monolithic and overlies all of the photodiodes;
wherein a surface area of the top surface of the glass covering is greater than a surface area of the bottom surface of the glass covering;
wherein a surface area of a top surface of the image sensor substrate is greater than the surface area of the bottom surface of the glass covering;
wherein an acute angle between the flat sidewall and the top surface of the glass is in a range of 40° to 60°; and
wherein a

Assignees

• St Microelectronics Pte Ltd

Inventors

• Herard Laurent
• Gani David

Classifications

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H10F39/026 Primary

  Wafer-level processing · CPC title

• H01L27/14618 Primary

  Electricity · mapped topic