Slanted glass edge for image sensor package

Patent metadata

Field	Value
Publication number	US-12356743-B2
Application number	US-202418582860-A
Country	US
Kind code	B2
Filing date	Feb 21, 2024
Priority date	Jun 4, 2020
Publication date	Jul 8, 2025
Grant date	Jul 8, 2025

Abstract

Disclosed herein is a method of reducing noise captured by an image sensor. The method includes affixing a bottom surface of a glass covering to the image sensor, permitting light to impinge upon the glass covering, and shaping the glass covering such that when the light that impinges upon the glass covering impinges upon a sidewall of the glass covering, the sidewall reflects the light on a trajectory away from the image sensor.

First claim

The invention claimed is:

1. A method of reducing noise captured by an image sensor, the method comprising:
forming a glass covering;
affixing a bottom surface of the glass covering to the image sensor;
permitting light to impinge upon the glass covering; and
wherein the forming of the glass covering comprises shaping the glass covering such that when the light that impinges upon the glass covering impinges upon a sidewall of the glass covering, the sidewall reflects the light on a trajectory away from the image sensor.

2. The method of claim 1 , wherein shaping the glass covering comprises shaping the glass covering to be trapezoidal in cross section such that when the light which impinges upon the glass covering impinges upon the sidewall of the trapezoidal cross section, the sidewall reflects the light on the trajectory away from the image sensor.

3. The method of claim 2 , wherein the trapezoidal cross section is defined by an obtuse angle formed between the sidewall and the bottom surface of the glass covering, facilitating redirection of incoming light.

4. The method of claim 2 , wherein an angle of the sidewall with respect to the bottom surface of the glass covering is adjusted based on a field of view of the image sensor and anticipated environmental lighting conditions.

5. The method of claim 2 , further wherein shaping the glass covering includes cutting the glass covering using mechanical sawing or chemical etching to achieve the trapezoidal cross section.

6. The method of claim 1 , wherein the glass covering is affixed to the image sensor using a transparent adhesive layer.

7. The method of claim 1 , further comprising positioning the glass covering at a predetermined distance from the image sensor to optimize trajectory of reflected light away from photodiodes of the image sensor.

8. The method of claim 1 , further comprising configuring a top surface of the glass covering to have a greater surface area than the bottom surface to facilitate desired light reflection characteristics of the sidewall.

9. A method of assembling a digital image sensor package, comprising:
positioning an image sensor substrate on a printed circuit board (PCB); and
associating a transparent covering with the image sensor substrate, the transparent covering having a bottom surface, a top surface opposite to the bottom surface, and a sidewall that delimits a perimeter edge of the transparent covering, such that the transparent covering overlies the image sensor substrate;
wherein the associating of the transparent covering with the image sensor substrate includes forming a first angle between the sidewall and the top surface of the transparent covering, and a second angle between the sidewall and the bottom surface of the transparent covering, where the second angle is different from the first angle, such that light entering the transparent covering on a first trajectory and impinging upon the sidewall is reflected on a second trajectory that avoids the image sensor substrate, thereby reducing noise in captured images.

10. The method of claim 9 , wherein the transparent covering is attached to the image sensor substrate using a transparent adhesive layer, providing for optical clarity and secure positioning of the transparent covering.

11. The method of claim 9 , further comprising shaping the sidewall of the transparent covering such that the first angle is an acute angle and the second angle is an obtuse angle.

12. The method of claim 9 , including selecting material forming the transparent covering is based on its optical properties to ensure it is conducive to reflecting light at desired specified angles without absorbing significant amounts of light.

13. The method of claim 9 , wherein dimensions of the transparent covering are determined based on a size of the image sensor substrate and an expected range of angles of incoming light.

14. A method of forming a digital image sensor package, the method comprising:
disposing an image sensor substrate on a printed circuit board (PCB), wherein photodiodes are formed on the image sensor substrate; and
forming a glass covering to have a top surface with a greater surface area than a bottom surface of the glass covering, a bottom surface, and a sidewall delimiting a perimeter edge of the glass covering, the sidewall forming an obtuse angle with the bottom surface and an acute angle with the top surface such that the sidewall is angled with respect to normal to direct incoming light along a trajectory that avoids the photodiodes.

15. The method of claim 14 , wherein the obtuse angle formed by the sidewall with the bottom surface is in a range of 120° to 140° and wherein the acute angle formed by the sidewall with the top surface is in a range of 40° to 60°.

16. The method of claim 14 , further comprising affixing mounting hardware to the printed circuit board to surround at least a portion of a periphery of the image sensor substrate in a spaced apart fashion before coupling the glass covering to the image sensor substrate, wherein the mounting hardware supports the glass covering in a predetermined position relative to the image sensor substrate.

17. The method of claim 16 , wherein the mounting hardware is formed to have a first portion affixed to the PCB extending upwardly therefrom, a second portion extending inwardly from the periphery of the image sensor substrate toward the photodiodes, and an intermediate connecting portion that connects the first portion to the second portion, structurally integrating the glass covering with the PCB and image sensor substrate.

Assignees

• St Microelectronics Pte Ltd

Inventors

• Herard Laurent
• Gani David

Classifications

• H10F39/809

  of hybrid image sensors · CPC title

• H10F39/804 Primary

  Containers or encapsulations · CPC title

• H10F39/026 Primary

  Wafer-level processing · CPC title