Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
US-11359055-B2 · Jun 14, 2022 · US
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Fukuda Tomio patents
Fukuda Tomio is listed as an inventor on 18 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Fukuda Tomio |
| Total patents | 18 |
| First publication | Feb 23, 2017 |
| Latest publication | Jun 14, 2022 |
Notable patents
Publications ranked by popularity score, then publication date.
Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
US-11339251-B2 · May 24, 2022 · US
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
US-11286346-B2 · Mar 29, 2022 · US
Resin composition, prepreg, laminate and multilayer printed wiring board
US-11041045-B2 · Jun 22, 2021 · US
Multilayer transmission line plate
US-10957964-B2 · Mar 23, 2021 · US
Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high speed communication-compatible module
US-10876000-B2 · Dec 29, 2020 · US
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
US-2020071464-A1 · Mar 5, 2020 · US
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
US-10519279-B2 · Dec 31, 2019 · US
Multilayer transmission line plate
US-10506705-B2 · Dec 10, 2019 · US
Resin composition, resin film, laminate, multilayer printed wiring board and method for producing multilayer printed wiring board
US-2019309130-A1 · Oct 10, 2019 · US
Recent patents
Latest publications not already listed above.
Thermosetting resin composition, prepreg, laminated board, printed wiring board, and high-speed communication-compatible module
US-2019169432-A1 · Jun 6, 2019 · US
Multilayer transmission line plate
US-2019023899-A1 · Jan 24, 2019 · US
Multilayer transmission line plate
US-2018139837-A1 · May 17, 2018 · US
Resin composition, prepreg, laminate and multilayer printed wiring board
US-2018134842-A1 · May 17, 2018 · US
Thermosetting resin composition, prepreg, laminate and multilayer printed wiring board
US-2018127547-A1 · May 10, 2018 · US
Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar
US-2018002485-A1 · Jan 4, 2018 · US
Polyphenylene ether derivative having N-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
US-9828466-B2 · Nov 28, 2017 · US
Polyphenylene ether derivative having n-substituted maleimide group, and heat curable resin composition, resin varnish, prepreg, metal-clad laminate, and multilayer printed wiring board using same
US-2017051109-A1 · Feb 23, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Hitachi Chemical Co Ltd | 19 |
| Showa Denko Materials Co Ltd | 6 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H05K1/0373 | 16 |
| C08J5/24 | 16 |
| C08J5/244 | 14 |
| C08L79/085 | 12 |
| C08L79/08 | 10 |