Resin composition, prepreg, laminate and multilayer printed wiring board

US11041045B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11041045-B2
Application numberUS-201615570215-A
CountryUS
Kind codeB2
Filing dateApr 28, 2016
Priority dateApr 30, 2015
Publication dateJun 22, 2021
Grant dateJun 22, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed wiring board using the resin composition. Specifically, the resin composition contains (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, (B) at least one thermosetting resin selected from the group consisting of epoxy resins, cyanate resins and maleimide compounds, and (C) a styrenic thermoplastic elastomer:wherein R1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4.

First claim

Opening claim text (preview).

The invention claimed is: 1. A resin composition comprising: (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule: wherein R 1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4, and wherein the N-substituted maleimide structure-containing group is a group represented by the following general formula (Z): wherein R 2 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, y represents an integer of 0 to 4, and A 1 represents a group represented by the following general formula (II), (III), (IV) or (V): wherein R 3 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and p represents an integer of 0 to 4: wherein R 4 and R 5 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a group represented by the following general formula (III-1), and q and r each independently represent an integer of 0 to 4: wherein R 6 and R 7 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 3 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond, and s and t each independently represent an integer of 0 to 4: wherein n represents an integer of 0 to 10, wherein R 8 and R 9 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and u represents an integer of 1 to 8; (B) at least one selected from the group consisting of an epoxy resin, a cyanate resin and a maleimide compound, and (C) a styrenic thermoplastic elastomer. 2. The resin composition according to claim 1 , wherein the structural unit represented by the general formula (I) is a structural unit represented by the following formula (I′): 3. The resin composition according to claim 1 , wherein A 1 in the general formula (Z) is a group represented by any of the following formulae: 4. A resin composition comprising: (A) a polyphenylene ether derivative having an N-substituted maleimide structure-containing group and a structural unit represented by the following general formula (I) in one molecule, wherein the N-substituted maleimide structure-containing group is a group containing a bismaleimide structure in which the nitrogen atoms of the two maleimide groups bond to each other via an organic group, wherein the number average molecular weight of the component (A) is from 5,000 to 12,000: wherein R 1 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and x represents an integer of 0 to 4; (B) at least one selected from the group consisting of an epoxy resin, a cyanate resin and a maleimide compound, and (C) a styrenic thermoplastic elastomer. 5. The resin composition according to claim 4 , wherein the maleimide compound in the component (B) is a polymaleimide compound (a) having at least two N-substituted maleimide groups in one molecule, or a polyaminobismaleimide compound (c) represented by the following general formula (VI): wherein A 4 represents a group represented by the following general formula (II), (III), (IV) or (V): wherein R 3 each independently represents an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, and p represents an integer of 0 to 4: wherein R 4 and R 5 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 2 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a single bond, or a group represented by the following general formula (III-1), and q and r each independently represent an integer of 0 to 4: wherein R 6 and R 7 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 3 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group or a single bond, and s and t each independently represent an integer of 0 to 4: wherein n represents an integer of 0 to 10, wherein R 8 and R 9 each independently represent a hydrogen atom, or an aliphatic hydrocarbon group having 1 to 5 carbon atoms, and u represents an integer of 1 to 8, and A 5 represents a group represented by the following general formula (VII): wherein R 17 and R 18 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom, A 8 represents an alkylene group having 1 to 5 carbon atoms, an alkylidene group having 2 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a carbonyloxy group, a keto group, a fluorenylene group, a single bond, or a group represented by the following general formula (VII-1) or (VII-2), and q′ and r′ each independently represent an integer of 0 to 4: wherein R 19 and R 20 each independently represent an aliphatic hydrocarbon group having 1 to 5 carbon atoms, or a halogen atom, A 9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an m-phenylenediisopro

Assignees

Inventors

Classifications

  • C08G73/127Primary

    containing oxygen in the form of ether bonds in the main chain · CPC title

  • characterised by the additives used in the prepolymer mixture · CPC title

  • using glass fibres · CPC title

  • Halogen-containing compounds · CPC title

  • C08G65/333Primary

    containing nitrogen · CPC title

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What does patent US11041045B2 cover?
Provided are a resin composition having especially good compatibility and having dielectric properties (low dielectric constant and low dielectric dissipation factor) in a high frequency range, high adhesion to conductor, excellent heat resistance, high glass transition temperature, low thermal expansion coefficient and high flame retardancy, and a prepreg, a laminate and a multilayer printed w…
Who is the assignee on this patent?
Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd
What technology area does this patent fall under?
Primary CPC classification C08G73/127. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 22 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).