Multilayer transmission line plate

Patent metadata

Field	Value
Publication number	US-10957964-B2
Application number	US-201616069542-A
Country	US
Kind code	B2
Filing date	Jul 20, 2016
Priority date	Jan 13, 2016
Publication date	Mar 23, 2021
Grant date	Mar 23, 2021

Abstract

Provided is a multilayered transmission line plate including one pair of ground layers, a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers, a first insulating portion disposed between the differential wiring layer and the one ground layer, and a second insulating portion disposed between the differential wiring layer and the other ground layer, wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer including a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion.

First claim

The invention claimed is:

1. A multilayered transmission line plate comprising:
one pair of ground layers,
a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers,
a first insulating portion disposed between the differential wiring layer and the one ground layer, and
a second insulating portion disposed between the differential wiring layer and the other ground layer,
wherein the first insulating portion has a resin layer, the first insulating portion or the second insulating portion has a fiber base material layer containing a fiber base material, and a thickness of the first insulating portion is equal to or thinner than a thickness of the second insulating portion, and
wherein the resin layer includes (A) a maleimide group-containing compound containing (a1) a divalent group having at least two imide bonds and (a2) a saturated or unsaturated divalent hydrocarbon group.

2. The multilayered transmission line plate of claim 1 , comprising a first insulating layer ( 1 -I) as the first insulating portion and a second insulating layer ( 1 -II) as the second insulating portion, wherein the first insulating layer ( 1 -I) is the resin layer and the second insulating layer ( 1 -II) is the fiber base material layer.

3. The multilayered transmission line plate of claim 1 , comprising an insulating layer ( 2 -I) as the second insulating portion and a further insulating layer ( 2 -II) as the first insulating portion, wherein the further insulating layer ( 2 -II) includes two or more layers of a first insulating layer ( 2 -IIA) and a second insulating layer ( 2 -IIB) laminated on the first insulating layer ( 2 -IIA), the insulating layer ( 2 -I) is the fiber base material layer, the first insulating layer ( 2 -IIA) is the resin layer, and the second insulating layer ( 2 -IIB) is a further fiber base material layer.

4. The multilayered transmission line plate of claim 1 , wherein a dielectric constant of the fiber base material is 5.0 or less.

5. The multilayered transmission line plate of claim 1 , wherein (a2) the saturated or unsaturated divalent hydrocarbon group is a divalent aliphatic hydrocarbon group having 8 to 100 carbon atoms.

6. The multilayered transmission line plate of claim 1 , wherein (A) the maleimide group-containing compound is an N-aliphatic substituted maleimide group-containing compound.

7. The multilayered transmission line plate of claim 6 , wherein the resin layer further includes an N-aromatic substituted maleimide group-containing compound.

8. The multilayered transmission line plate of claim 1 , wherein the fiber base material layer is a layer including a fiber base material and a resin composition, and a difference in dielectric constant between the fiber base material and the resin composition is 1.0 or less.

9. A multilayered transmission line plate comprising:
one pair of ground layers,
a differential wiring layer disposed between one ground layer and the other ground layer of the one pair of ground layers,
an insulating layer ( 3 -I) disposed between the differential wiring layer and the one ground layer, no fiber base material layer being disposed between the differential wiring layer and the one ground layer, and
a further insulating layer ( 3 -II) disposed between the differential wiring layer and the other ground layer, wherein the further insulating layer ( 3 -II) has two or more layers of a first insulating layer ( 3 -IIA) and a second insulating layer ( 3 -IIB) laminated on the first insulating layer ( 3 -IIA), the insulating layer ( 3 -I) is a resin layer, the first insulating layer ( 3 -IIA) is a resin layer, and the second insulating layer ( 3 -IIB) is a fiber base material layer.

Assignees

• Hitachi Chemical Co Ltd
• Showa Denko Materials Co Ltd

Inventors

• Tanigawa Takao
• Irino Tetsurou
• Kondou Yuusuke
• Mizushima Etsuo
• Fukuda Tomio
• Nagai Yuki

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• C08J5/244

  using glass fibres · CPC title

• H05K1/0248 Primary

  Skew reduction or using delay lines · CPC title

• H05K1/0366

  reinforced, e.g. by fibres, fabrics (H05K1/036 takes precedence) · CPC title

• C08G73/121

  Preparatory processes from unsaturated precursors and polyamines · CPC title