Resin composition, support with resin layer, prepreg, laminate, multilayered printed wiring board, and printed wiring board for millimeter-wave radar

Patent metadata

Field	Value
Publication number	US-11286346-B2
Application number	US-201615543078-A
Country	US
Kind code	B2
Filing date	Jan 13, 2016
Priority date	Jan 13, 2015
Publication date	Mar 29, 2022
Grant date	Mar 29, 2022

Abstract

The present invention relates to a resin composition containing a compound having a maleimido group, a divalent group having at least two imido bonds and a saturated or unsaturated divalent hydrocarbon group.

First claim

The invention claimed is:

1. A resin composition comprising:
a compound (A) having a maleimido group, a divalent group having at least two imido bonds, and a saturated or unsaturated divalent hydrocarbon group, the divalent hydrocarbon group not including a phenylene group, wherein the divalent group having at least two imido bonds is a group represented by the following formula (I):

wherein in the formula (I), R 1 represents a tetravalent organic group;
a maleimido group-containing compound (B) different from the compound (A), the maleimido group-containing compound (B) comprising an aromatic ring; and
an inorganic filler,
wherein the content of the compound (A) is 2% by mass or greater and 50% by mass or less based on the total mass of the resin composition, and
the content ratio of the inorganic filler is 5 to 70% by volume with respect to the total volume of the solid content in the resin composition.

2. The resin composition according to claim 1 , wherein the number of carbon atoms of the saturated or unsaturated divalent hydrocarbon group is 8 to 100.

3. The resin composition according to claim 1 , wherein the saturated or unsaturated divalent hydrocarbon group is a group represented by the following formula (II):

wherein in the formula (II), R 2 and R 3 each independently represent an alkylene group having 4 to 50 carbon atoms; R 4 represents an alkyl group having 4 to 50 carbon atoms; and R 5 represents an alkyl group having 2 to 50 carbon atoms.

4. The resin composition according to claim 1 , wherein the maleimido group-containing compound (B) has a structure having the maleimido group bonded to the aromatic ring.

5. The resin composition according to claim 1 , wherein the maleimido group-containing compound (B) is a compound represented by the following formula (VI):

wherein in the formula (VI), A 4 represents a residue represented by the following formula (VII), (VIII), (IX) or (X); and A 5 represents a residue represented by the following formula (XI):

wherein in the formula (VII), R 10 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom,

wherein in the formula (VIII), R 11 and R 12 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 6 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a ketone group, a single bond or a residue represented by the following formula (VIII-1):

wherein in the formula (VIII-I), R 13 and R 14 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 7 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a ketone group or a single bond,

wherein in the formula (IX), i is an integer of 1 to 10,

wherein in the formula (X), R 15 and R 16 each independently represent a hydrogen atom or an aliphatic hydrocarbon group having 1 to 5 carbon atoms; and j is an integer of 1 to 8,

wherein in the formula (XI), R 17 and R 18 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms, an alkoxy group having 1 to 5 carbon atoms, a hydroxyl group or a halogen atom; and A 8 represents an alkylene group or an alkylidene group having 1 to 5 carbon atoms, an ether group, a sulfide group, a sulfonyl group, a ketone group, a fluorenylene group, a single bond, a residue represented by the following formula (XI-1) or a residue represented by the following formula (XI-2):

wherein in the formula (XI-I), R 19 and R 20 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom;
and A 9 represents an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, a m-phenylenediisopropylidene group, a p-phenylenediisopropylidene group, an ether group, a sulfide group, a sulfonyl group, a ketone group or a single bond, and

wherein in the formula (XI-2), R 21 each independently represent a hydrogen atom, an aliphatic hydrocarbon group having 1 to 5 carbon atoms or a halogen atom; and A 10 and A 11 each independently represent an alkylene group having 1 to 5 carbon atoms, an isopropylidene group, an ether group, a sulfide group, a sulfonyl group, a ketone group or a single bond.

6. The resin composition according to claim 1 , wherein a relative dielectric constant at 10 GHz of a cured substance of the resin composition is 3.6 or lower.

7. A support with a resin layer comprising:
a resin layer comprising the resin composition according to claim 1 ; and
a support base material.

8. A prepreg comprising:
the resin composition according to claim 1 ; and
a fiber base material.

9. A laminate comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
a conductor layer.

10. A multilayered printed wiring board comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
at least three layers of circuit layers.

11. The multilayered printed wiring board according to claim 10 , wherein the number of the circuit layers is 3 to 20 layers.

12. A communication device comprising a multilayered printed wiring board for millimeter-wave radar, the multilayered printed wiring board comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
at least three layers of circuit layers.

13. The communication device according to claim 12 , wherein the communication device comprises a mobile communication device.

14. A printed wiring board for a millimeter-wave radar comprising:
a resin layer comprising a cured substance of the resin composition according to claim 1 ; and
a circuit layer.

15. The resin composition according to claim 1 , wherein the content of the compound (A) is 2% by mass or greater and 30% by mass or less based on the total mass of the resin composition.

16. A resin composition comprising:
a compound (A) having a maleimido group, a divalent group having at least two imido bonds, and a saturated or unsaturated divalent hydrocarbon group, the divalent hydrocarbon group not including a phe

Assignees

• Hitachi Chemical Co Ltd
• Showa Denko Materials Co Ltd

Inventors

• Tanigawa Takao
• IRINO Tetsuroh
• Kondou Yuusuke
• Shimayama Yuichi
• Mizushima Etsuo
• Fukuda Tomio
• Nagai Yuki
• Murai Hikari

Classifications

• C08G73/1014 Primary

  in the form of (mono)anhydrid · CPC title

• C08J5/244

  using glass fibres · CPC title

• B32B2038/047

  Perforating · CPC title

• H05K3/46

  Manufacturing multilayer circuits · CPC title

• B32B37/10

  characterised by the pressing technique, e.g. using action of vacuum or fluid pressure · CPC title