Vinyl-modified maleimide, composition and article made thereby
US-2018362715-A1 · Dec 20, 2018 · US
Unsaturated polyimide precursors
Unsaturated polyimide precursors · Cooperative Patent Classification (CPC)
Chemical and metallurgical processes, compounds, and materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | C08L79/085 |
| Official title | {Unsaturated polyimide precursors} |
| Display label | Unsaturated polyimide precursors |
| Total patents | 385 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 13 |
| 2016 | 17 |
| 2017 | 13 |
| 2018 | 30 |
| 2019 | 33 |
| 2020 | 36 |
| 2021 | 46 |
| 2022 | 39 |
| 2023 | 45 |
| 2024 | 47 |
| 2025 | 57 |
| 2026 | 9 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Thermosetting resin composition, prepreg containing same, laminated board, and printed circuit board
US-2018346675-A1 · Dec 6, 2018 · US
Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same
US-2018327593-A1 · Nov 15, 2018 · US
Low aromatic content bio-mass fillers for free radical and ionic cure thermoset polymers
US-10125260-B2 · Nov 13, 2018 · US
Resin compositions for underfill film for three dimensional through silica via (tsv) packages and compositions useful for the preparation thereof
US-2018319973-A1 · Nov 8, 2018 · US
Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same
US-10119047-B2 · Nov 6, 2018 · US
Curable fiberglass binder comprising salt of inorganic acid
US-10099959-B2 · Oct 16, 2018 · US
Method of manufacturing resin impregnated material, composite material and copper-clad laminate
US-10059083-B2 · Aug 28, 2018 · US
Resin-clad copper foil, and printed wiring board
US-2018222152-A1 · Aug 9, 2018 · US
Resin composition and prepreg, resin sheet, laminate, and printed circuit board comprising same
US-2018179354-A1 · Jun 28, 2018 · US
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board
US-2018179355-A1 · Jun 28, 2018 · US
Resin composition, prepreg or resin sheet comprising the resin composition, and laminate and printed circuit board comprising them
US-2018177047-A1 · Jun 21, 2018 · US
Method for producing printed circuit board, and resin composition
US-2018163048-A1 · Jun 14, 2018 · US
Diene/dienophile couples and thermosetting resin compositions having reworkability
US-2018155588-A1 · Jun 7, 2018 · US
Method of manufacturing resin impregnated material, composite material and copper-clad laminate
US-2018086025-A1 · Mar 29, 2018 · US
Remendable interfaces for polymer composites
US-9884944-B2 · Feb 6, 2018 · US
Maleimide resins
US-9884942-B2 · Feb 6, 2018 · US
Curable mixtures based on xylylene bismaleimide
US-9828468-B2 · Nov 28, 2017 · US
Resistive grid elements having a thermosetting polymer
US-9824797-B2 · Nov 21, 2017 · US
Resin composition, prepreg, metal foil-clad laminate, resin composite sheet, and printed wiring board
US-2017313854-A1 · Nov 2, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC C08L79/085?
- CPC C08L79/085 is the Cooperative Patent Classification code for “Unsaturated polyimide precursors.”
- How many patents are filed under CPC C08L79/085 (Unsaturated polyimide precursors)?
- Our database includes 385 publications tagged with this CPC code.
- Is patent activity under CPC C08L79/085 growing?
- Publication counts under this code: 47 in 2024 vs 57 in 2025 (latest complete years).