Porous mesh structures for the thermal management of integrated circuit devices
US-12532740-B2 · Jan 20, 2026 · US
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Diglio Paul patents
Diglio Paul is listed as an inventor on 34 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Diglio Paul |
| Total patents | 34 |
| First publication | Oct 17, 2017 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Water Vapor Die Temperature Controls for Two-Phase Jet Impingement Testing
US-2026002842-A1 · Jan 1, 2026 · US
Directly impinging pressure modulated spray cooling and methods of target temperature control
US-12500137-B2 · Dec 16, 2025 · US
Method and device for fast, passive alignment in photonics assembly
US-12493151-B2 · Dec 9, 2025 · US
Optical connectors with alignment features
US-2025291134-A1 · Sep 18, 2025 · US
Enhanced jet impingement leak prevention for integrated circuit
US-12392818-B2 · Aug 19, 2025 · US
Multi zone temperature control for devices under test
US-2025208197-A1 · Jun 26, 2025 · US
Title direct fluid cooling with multi temperature control
US-2025208190-A1 · Jun 26, 2025 · US
Integrated circuit die packages including a contiguous heat spreader
US-12136577-B2 · Nov 5, 2024 · US
Additively manufactured structures for heat dissipation from integrated circuit devices
US-12080620-B2 · Sep 3, 2024 · US
Recent patents
Latest publications not already listed above.
Vacuum modulated two phase cooling loop efficiency and parallelism enhancement
US-12057370-B2 · Aug 6, 2024 · US
Thermally enhanced silicon back end layers for improved thermal performance
US-12021016-B2 · Jun 25, 2024 · US
System and apparatus having a seal member for sealing of a device under test
US-12000487-B2 · Jun 4, 2024 · US
Enhanced jet impingement leak prevention for integrated circuit
US-2024175917-A1 · May 30, 2024 · US
Vacuum modulated two phase cooling loop performance enhancement
US-11976671-B2 · May 7, 2024 · US
Method and device for fast, passive alignment in photonics assembly
US-2024111098-A1 · Apr 4, 2024 · US
System and apparatus having a seal member for sealing of a device under test
US-2024068572-A1 · Feb 29, 2024 · US
Method and device for fast, passive alignment in photonics assembly
US-11808988-B2 · Nov 7, 2023 · US
Self-docking self-aligned optical pcb connector for semiconductor packages
US-2023314733-A1 · Oct 5, 2023 · US
Porous mesh structures for the thermal management of integrated circuit devices
US-2023317549-A1 · Oct 5, 2023 · US
Method and system for attaching optical fibers to warped photonic chips
US-11762157-B2 · Sep 19, 2023 · US
Dual feed cold spray nozzle with separate temperature and feeding rate control
US-2023285999-A1 · Sep 14, 2023 · US
Reusable composite stencil for spray processes
US-2023271445-A1 · Aug 31, 2023 · US
Directly impinging pressure modulated spray cooling and methods of target temperature control
US-2023260870-A1 · Aug 17, 2023 · US
Method and system for attaching optical fibers to warped photonic chips
US-2022011529-A1 · Jan 13, 2022 · US
Method and device for fast, passive alignment in photonics assembly
US-2022011517-A1 · Jan 13, 2022 · US
Additively manufactured structures for heat dissipation from integrated circuit devices
US-2021407884-A1 · Dec 30, 2021 · US
Integrated circuit die packages including a contiguous heat spreader
US-2021407877-A1 · Dec 30, 2021 · US
Thermally enhanced silicon back end layers for improved thermal performance
US-2021391244-A1 · Dec 16, 2021 · US
Vacuum modulated two phase cooling loop efficiency and parallelism enhancement
US-2021351108-A1 · Nov 11, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Corp | 34 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G01R31/2874 | 11 |
| G01R31/2863 | 8 |
| G02B6/30 | 7 |
| H10W40/475 | 7 |
| G01R31/2862 | 7 |