Vacuum modulated two phase cooling loop efficiency and parallelism enhancement

US12057370B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12057370-B2
Application numberUS-202017030137-A
CountryUS
Kind codeB2
Filing dateSep 23, 2020
Priority dateMay 11, 2020
Publication dateAug 6, 2024
Grant dateAug 6, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.

First claim

Opening claim text (preview).

What is claimed is: 1. A temperature control system, comprising: a fluid reservoir for holding a fluid; a spray chamber fluidically coupled to the fluid reservoir; a pump between the spray chamber and the fluid reservoir, wherein the pump provides the fluid to the spray chamber; a plurality of fluid lines between the pump and the spray chamber, wherein individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber, wherein the plurality of fluid lines comprises a first fluid line and a second fluid line, and wherein an inline heater is provided on the first fluid line; and a vacuum source fluidically coupled to the spray chamber, wherein the fluid reservoir is between the vacuum source and the spray chamber, and wherein the vacuum source controls a pressure within the spray chamber. 2. The temperature control system of claim 1 , wherein the plurality of fluid lines feed into a single input line to the spray chamber. 3. The temperature control system of claim 2 , wherein the single input line feeds a plurality of nozzles in the spray chamber. 4. The temperature control system of claim 1 , wherein the plurality of fluid lines feed into a plurality of input lines to the spray chamber. 5. The temperature control system of claim 4 , wherein individual ones of the plurality of input lines feed different nozzles in the spray chamber. 6. The temperature control system of claim 1 , further comprising: a cooling unit. 7. The temperature control system of claim 6 , wherein the cooling unit is a radiator. 8. The temperature control system of claim 7 , wherein an input to the cooling unit is between the pump and the spray chamber, and wherein an output of the cooling unit feeds into the fluid reservoir. 9. A temperature control system, comprising: a fluid reservoir for holding a fluid; a spray chamber fluidically coupled to the fluid reservoir; a pump between the spray chamber and the fluid reservoir, wherein the pump provides the fluid to the spray chamber; a plurality of fluid lines between the pump and the spray chamber, wherein individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber; a vacuum source fluidically coupled to the spray chamber, wherein the fluid reservoir is between the vacuum source and the spray chamber, and wherein the vacuum source controls a pressure within the spray chamber; and a cooling unit, wherein the cooling unit is a radiator, and wherein an input to the cooling unit is between the pump and the spray chamber, and wherein an output of the cooling unit feeds into the fluid reservoir. 10. The temperature control system of claim 9 , wherein the plurality of fluid lines feed into a single input line to the spray chamber. 11. The temperature control system of claim 10 , wherein the single input line feeds a plurality of nozzles in the spray chamber. 12. The temperature control system of claim 9 , wherein the plurality of fluid lines feed into a plurality of input lines to the spray chamber. 13. The temperature control system of claim 12 , wherein individual ones of the plurality of input lines feed different nozzles in the spray chamber.

Assignees

Inventors

Classifications

  • for cooling by change of state · CPC title

  • wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

  • H10W40/475Primary

    using jet impingement (H10W40/776 takes precedence) · CPC title

  • Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

  • Chambers or ovens; Tanks · CPC title

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Frequently asked questions

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What does patent US12057370B2 cover?
Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature…
Who is the assignee on this patent?
Intel Corp
What technology area does this patent fall under?
Primary CPC classification H10W40/475. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Aug 06 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).