Microfluidic impingement jet cooled embedded diamond GaN HEMT
US-9484284-B1 · Nov 1, 2016 · US
US12057370B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12057370-B2 |
| Application number | US-202017030137-A |
| Country | US |
| Kind code | B2 |
| Filing date | Sep 23, 2020 |
| Priority date | May 11, 2020 |
| Publication date | Aug 6, 2024 |
| Grant date | Aug 6, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Embodiments disclosed herein include a temperature control system. In an embodiment, the temperature control system comprises a fluid reservoir for holding a fluid, and a spray chamber fluidically coupled to the fluid reservoir. In an embodiment, a pump is between the spray chamber and the fluid reservoir, where the pump provides the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a plurality of fluid lines between the pump and the spray chamber, where individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber. In an embodiment, the temperature control system further comprises, a vacuum source fluidically coupled to the spray chamber, where the vacuum source controls a pressure within the spray chamber.
Opening claim text (preview).
What is claimed is: 1. A temperature control system, comprising: a fluid reservoir for holding a fluid; a spray chamber fluidically coupled to the fluid reservoir; a pump between the spray chamber and the fluid reservoir, wherein the pump provides the fluid to the spray chamber; a plurality of fluid lines between the pump and the spray chamber, wherein individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber, wherein the plurality of fluid lines comprises a first fluid line and a second fluid line, and wherein an inline heater is provided on the first fluid line; and a vacuum source fluidically coupled to the spray chamber, wherein the fluid reservoir is between the vacuum source and the spray chamber, and wherein the vacuum source controls a pressure within the spray chamber. 2. The temperature control system of claim 1 , wherein the plurality of fluid lines feed into a single input line to the spray chamber. 3. The temperature control system of claim 2 , wherein the single input line feeds a plurality of nozzles in the spray chamber. 4. The temperature control system of claim 1 , wherein the plurality of fluid lines feed into a plurality of input lines to the spray chamber. 5. The temperature control system of claim 4 , wherein individual ones of the plurality of input lines feed different nozzles in the spray chamber. 6. The temperature control system of claim 1 , further comprising: a cooling unit. 7. The temperature control system of claim 6 , wherein the cooling unit is a radiator. 8. The temperature control system of claim 7 , wherein an input to the cooling unit is between the pump and the spray chamber, and wherein an output of the cooling unit feeds into the fluid reservoir. 9. A temperature control system, comprising: a fluid reservoir for holding a fluid; a spray chamber fluidically coupled to the fluid reservoir; a pump between the spray chamber and the fluid reservoir, wherein the pump provides the fluid to the spray chamber; a plurality of fluid lines between the pump and the spray chamber, wherein individual ones of the plurality of fluid lines are configured to provide the fluid to the spray chamber; a vacuum source fluidically coupled to the spray chamber, wherein the fluid reservoir is between the vacuum source and the spray chamber, and wherein the vacuum source controls a pressure within the spray chamber; and a cooling unit, wherein the cooling unit is a radiator, and wherein an input to the cooling unit is between the pump and the spray chamber, and wherein an output of the cooling unit feeds into the fluid reservoir. 10. The temperature control system of claim 9 , wherein the plurality of fluid lines feed into a single input line to the spray chamber. 11. The temperature control system of claim 10 , wherein the single input line feeds a plurality of nozzles in the spray chamber. 12. The temperature control system of claim 9 , wherein the plurality of fluid lines feed into a plurality of input lines to the spray chamber. 13. The temperature control system of claim 12 , wherein individual ones of the plurality of input lines feed different nozzles in the spray chamber.
for cooling by change of state · CPC title
wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title
using jet impingement (H10W40/776 takes precedence) · CPC title
Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title
Chambers or ovens; Tanks · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.