Directly impinging pressure modulated spray cooling and methods of target temperature control

Patent metadata

Field	Value
Publication number	US-12500137-B2
Application number	US-202318137987-A
Country	US
Kind code	B2
Filing date	Apr 21, 2023
Priority date	May 11, 2020
Publication date	Dec 16, 2025
Grant date	Dec 16, 2025

Abstract

Embodiments disclosed herein include a thermal testing unit. In an embodiment, the thermal testing unit comprises a nozzle frame, and a nozzle plate within the frame. In an embodiment, the nozzle plate comprises a plurality of orifices through a thickness of the nozzle plate. In an embodiment, the thermal testing unit further comprises a housing attached to the nozzle plate.

First claim

What is claimed is:

1 . A temperature control system, comprising:
a fluid reservoir for holding a fluid; a spray chamber fluidically coupled to the fluid reservoir; a pump between the spray chamber and the fluid reservoir, wherein the pump provides the fluid to the spray chamber; a vacuum pump fluidically coupled to the spray chamber, wherein the vacuum pump controls a pressure within the spray chamber; and a pressure regulator that controls the vacuum pump.

2 . The temperature control system of claim 1 , wherein a die is thermally coupled to the spray chamber.

3 . The temperature control system of claim 2 , wherein the die is within the spray chamber.

4 . The temperature control system of claim 2 , further comprising a thermal plate between the spray chamber and the die.

5 . The temperature control system of claim 1 , wherein the fluid reservoir comprises:
a heating element; and a cooling element.

Assignees

• Intel Corp

Inventors

• Subrahmanyam Prabhakar
• Wondimu Tewodros
• Pang Ying-Feng
• Ahmad Muhammad
• Diglio Paul
• Shia David
• Tadayon Pooya

Classifications

• H10W40/73 Primary

  for cooling by change of state · CPC title

• H10W40/30

  wherein the packaged device is completely immersed in a fluid other than air, e.g. immersed in a cryogenic fluid · CPC title

• H10W40/475 Primary

  using jet impingement (H10W40/776 takes precedence) · CPC title

• G01R31/2642

  Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests · CPC title

• B05B1/14

  with multiple outlet openings (B05B1/02, B05B1/26 take precedence); with strainers in or outside the outlet opening · CPC title