Enhanced jet impingement leak prevention for integrated circuit

Patent metadata

Field	Value
Publication number	US-12392818-B2
Application number	US-202218071399-A
Country	US
Kind code	B2
Filing date	Nov 29, 2022
Priority date	Nov 29, 2022
Publication date	Aug 19, 2025
Grant date	Aug 19, 2025

Abstract

This disclosure describes systems, methods, and devices related to preventing water leakage from jet impingement applied to an integrated circuit under test. An integrated circuit testing apparatus for applying jet impingement to an integrated circuit may include an impingement chamber in contact with an integrated circuit being tested, the impingement chamber comprising water associated with cooling the integrated circuit; and an actuator-driven thermal management block including an air inlet configured to direct a flow of air into an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to the water in the impingement chamber to prevent leakage of the water from the impingement chamber.

First claim

What is claimed is:

1. An integrated circuit testing apparatus for applying jet impingement to an integrated circuit, the integrated circuit testing apparatus comprising:
an actuator-driven thermal management block comprising seals and an air inlet configured to direct a flow of air into an immediate test environment for an integrated circuit to generate a positive pressure differential with respect to water in an impingement chamber to prevent leakage of the water from the impingement chamber, the impingement chamber formed by the integrated circuit, the actuator-driven thermal management block, and the seals.

2. The integrated circuit testing apparatus of claim 1 , wherein the air inlet extends through the actuator-driven thermal management block.

3. The integrated circuit testing apparatus of claim 1 , wherein the immediate test environment at least partially surrounds the integrated circuit, a socket arranged between the integrated circuit and a circuit board connected to the integrated circuit, and the actuator-driven thermal management block.

4. The integrated circuit testing apparatus of claim 1 , further comprising a first O-ring seal and a second O-ring seal, the first O-ring seal and the second O-ring seal between the actuator-driven thermal management block and a socket arranged between the integrated circuit and a circuit board.

5. The integrated circuit testing apparatus of claim 4 , further comprising a third O-ring seal and a fourth O-ring seal, the third O-ring seal and the fourth O-ring seal between the socket and the circuit board.

6. The integrated circuit testing apparatus of claim 4 , wherein the first O-ring seal and the second O-ring seal comprise an elastomer.

7. The integrated circuit testing apparatus of claim 4 , wherein the first O-ring seal and the second O-ring seal comprise silicone.

8. The integrated circuit testing system of claim 4 , wherein the first O-ring seal and the second O-ring seal comprise silicone.

9. An integrated circuit testing system for applying jet impingement to an integrated circuit, the integrated circuit testing apparatus comprising:
a socket arranged between an integrated circuit and a circuit board and with which the integrated circuit connects to the circuit board; and
an actuator-driven thermal management block comprising seals and an air inlet configured to direct a flow of air into an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to water in an impingement chamber to prevent leakage of the water from the impingement chamber, the impingement chamber formed by the integrated circuit, the actuator-driven thermal management block, and the seals.

10. The integrated circuit testing system of claim 9 , wherein the air inlet extends through the actuator-driven thermal management block.

11. The integrated circuit testing system of claim 9 , wherein the immediate test environment at least partially surrounds the integrated circuit, a socket arranged between the integrated circuit and a circuit board connected to the integrated circuit, and the actuator-driven thermal management block.

12. The integrated circuit testing system of claim 9 , further comprising a first O-ring seal and a second O-ring seal, the first O-ring seal and the second O-ring seal between the actuator-driven thermal management block and the socket.

13. The integrated circuit testing system of claim 12 , further comprising a third O-ring seal and a fourth O-ring seal, the third O-ring seal and the fourth O-ring seal between the socket and the circuit board.

14. The integrated circuit testing system of claim 12 , wherein the first O-ring seal and the second O-ring seal comprise an elastomer.

15. A method for applying jet impingement to an integrated circuit being tested, the method comprising:
receiving, by an inlet of an actuator-driven thermal management block associated with testing of the integrated circuit, a flow of air associated with preventing leakage of water from an impingement chamber, the impingement chamber formed by the integrated circuit, the actuator-driven thermal management block, and first seals; and
directing, by the inlet, the flow of air through the actuator-driven thermal management block to an immediate test environment for the integrated circuit to generate a positive pressure differential with respect to the water in the impingement chamber to prevent leakage of the water from the impingement chamber; and
limiting the flow of air using second seals in a socket through which the integrated circuit connects to a circuit board.

16. The method of claim 15 , wherein the second seals comprise an elastomer.

17. The method of claim 15 , wherein the second seals comprise silicone.

Assignees

• Intel Corp

Inventors

• Nunez Blanco Ruben
• Ackerman Christopher
• Diglio Paul
• Narayan Varun
• Yost Craig
• Stenberg Jensen
• Lofgreen Kelly
• Petrini Joseph
• Alelyani Sami

Classifications

• H10W40/43

  by flowing gases, e.g. forced air cooling · CPC title

• H10W40/475

  using jet impingement (H10W40/776 takes precedence) · CPC title

• G01R31/2863

  Contacting devices, e.g. sockets, burn-in boards or mounting fixtures (in general G01R1/04) · CPC title

• G01R31/2862

  Chambers or ovens; Tanks · CPC title

• G01R31/2874

  related to temperature · CPC title