Cooler
US-10147669-B2 · Dec 4, 2018 · US
using jet impingement (H10W40/776 takes precedence)
using jet impingement (H10W40/776 takes precedence) · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10W40/475 |
| Official title | {using jet impingement (H10W40/776 takes precedence)} |
| Display label | using jet impingement (H10W40/776 takes precedence) |
| Total patents | 326 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 18 |
| 2016 | 22 |
| 2017 | 16 |
| 2018 | 19 |
| 2019 | 26 |
| 2020 | 43 |
| 2021 | 29 |
| 2022 | 30 |
| 2023 | 35 |
| 2024 | 33 |
| 2025 | 44 |
| 2026 | 11 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
High efficiency thermal management system
US-10088238-B2 · Oct 2, 2018 · US
Electronic Assemblies Having A Cooling Chip Layer With Fluid Channels And Through Substrate Vias
US-2018145009-A1 · May 24, 2018 · US
Method and apparatus for chip cooling
US-9887146-B2 · Feb 6, 2018 · US
Heat dissipation apparatus and electronic device
US-9823716-B2 · Nov 21, 2017 · US
Cooling assemblies having porous three dimensional surfaces
US-9803938-B2 · Oct 31, 2017 · US
Semiconductor module
US-2017278770-A1 · Sep 28, 2017 · US
Method and Apparatus for Cooling Integrated Circuits
US-2017250123-A1 · Aug 31, 2017 · US
Cooling device and cooling device manufacturing method
US-2017223869-A1 · Aug 3, 2017 · US
Power conversion device
US-2017223875-A1 · Aug 3, 2017 · US
Liquid cooling of electronic devices
US-2017196120-A1 · Jul 6, 2017 · US
Heat dissipation apparatus and electronic device
US-2017185113-A1 · Jun 29, 2017 · US
Temperature equalization apparatus jetting fluid for thermal conduction used in electrical equipment
US-9648781-B2 · May 9, 2017 · US
Direct air impingement cooling of package structures
US-9612060-B2 · Apr 4, 2017 · US
Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Cooling Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems
US-2017092565-A1 · Mar 30, 2017 · US
Substrate sprayer
US-2017084514-A1 · Mar 23, 2017 · US
Liquid-cooled, composite heat sink assemblies
US-2017045300-A1 · Feb 16, 2017 · US
Liquid cooling block with shunt design and heat dissipating structure thereof
US-2017045307-A1 · Feb 16, 2017 · US
Liquid-cooled, composite heat sink assemblies
US-2017043437-A1 · Feb 16, 2017 · US
Thermal management system and method
US-2017040242-A1 · Feb 9, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10W40/475?
- CPC H10W40/475 is the Cooperative Patent Classification code for “using jet impingement (H10W40/776 takes precedence).”
- How many patents are filed under CPC H10W40/475 (using jet impingement (H10W40/776 takes precedence))?
- Our database includes 326 publications tagged with this CPC code.
- Is patent activity under CPC H10W40/475 growing?
- Publication counts under this code: 33 in 2024 vs 44 in 2025 (latest complete years).